Patents Assigned to Amitec-Advanced Multilayer Interconnect Technoloiges Ltd.
  • Advanced multilayer coreless support structures and method for their fabrication
    Patent number: 7682972
    Abstract: A method of fabricating a free standing membrane including via array in a dielectric for use as a precursor in the construction of superior electronic support structures, includes the steps of fabricating a membrane of conductive vias in a dielectric surround on a sacrificial carrier, and detaching the membrane from the sacrificial carrier to form a free standing laminated array. An electronic substrate based on such a free standing membrane may be formed by thinning and planarizing laminated array, followed by terminating.
    Type: Grant
    Filed: June 1, 2006
    Date of Patent: March 23, 2010
    Assignee: Amitec-Advanced Multilayer Interconnect Technoloiges Ltd.
    Inventors: Dror Hurwitz, Mordechay Farkash, Eva Igner, Boris Statnikov, Benny Michaeli