Patents Assigned to Amkor Technology Singapore Holding Pte. Lte.
  • Patent number: 11574890
    Abstract: In one example, a semiconductor device comprises a first base substrate comprising a first base conductive structure, a first encapsulant contacting a lateral side of the first base substrate, a redistribution structure (RDS) substrate over the base substrate and comprising an RDS conductive structure coupled with the first base conductive structure, a first electronic component over the RDS substrate and over a first component terminal coupled with the RDS conductive structure, and a second encapsulant over the RDS substrate and contacting a lateral side of the first electronic component. Other examples and related methods are also disclosed herein.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: February 7, 2023
    Assignee: Amkor Technology Singapore Holding Pte. Lte.
    Inventors: Yi Seul Han, Tae Yong Lee, Ji Yeon Ryu, Won Chul Do, Jin Young Khim, Shaun Bowers, Ron Huemoeller