Abstract: A casing structure with functionality of effective thermal management is disclosed, which consists of a casing member, a low thermal conductivity medium, a second heat spreader, and a first heat spreader. When a user operates the electronic device, heat generated from CPU and/or GPU is transferred to the second heat spreader via the first heat spreader, and then is two-dimensionally spread in the second heat spreader. Consequently, the heat is dissipated away from the casing member to air due to the outstanding thermal radiation ability of the casing member. The low thermal conductivity medium is adopted for controlling a heat transfer of heat transferring paths from the heat source and ends to the casing member. By applying the casing structure in an electronic device by a form of a top casing and/or a back casing, an outer surface temperature of the casing member can be well controlled.

Abstract: A Mg—Li—Al—Zn alloy is disclosed. The Mg—Li—Al—Zn alloy comprises, in weight percent: 5-15% Li, 1.5-9.0% Al, 0.5-1.5% Zn, 0.4-1.3% Y, 0.18-1.01% Nd, 0.09-0.65% Ce, and the balance Mg and incidental impurities. Experimental data have proved that, this novel Mg—Li—Al—Zn alloy has a flashover temperature in a range between 620° C. and 700° C., such that the flashover temperature of the specifically-designed Mg—Li—Al—Zn alloy is greater than that of commercial LAZ521, LAZ721, LAZ771, LAZ921, and LAZ1491 alloys. Therefore, the Mg—Li—Al—Zn alloy of the present invention can be processed to be a structural article through air melt and casting process.

Abstract: A casing structure with functionality of effective thermal management is disclosed, which consists of a casing member, a low thermal conductivity medium, a second heat spreader, and a first heat spreader. When a user operates the electronic device, heat generated from CPU and/or GPU is transferred to the second heat spreader via the first heat spreader, and then is two-dimensionally spread in the second heat spreader. Consequently, the heat is dissipated away from the casing member to air due to the outstanding thermal radiation ability of the casing member. The low thermal conductivity medium is adopted for controlling a heat transfer of heat transferring paths from the heat source and ends to the casing member. By applying the casing structure in an electronic device by a form of a top casing and/or a back casing, an outer surface temperature of the casing member can be well controlled.

Abstract: A magnesium alloy includes Mg, 1 to 12 wt % of Li, 1 to 10 wt % of Al and 0.2 to 3 wt % of Zn. The magnesium alloy has a microstructure which includes a nanoscale reinforcement phase, wherein the nanoscale reinforcement phase is a Li—Al compound.

Abstract: A magnesium alloy includes Mg, 1 to 12 wt % of Li, 1 to 10 wt % of Al and 0.2 to 3 wt % of Zn. The magnesium alloy has a microstructure which includes a nanoscale reinforcement phase, wherein the nanoscale reinforcement phase is a Li—Al compound.

Abstract: A magnesium alloy is disclosed. The magnesium alloy includes magnesium (Mg), 6-12 wt % of lithium (Li) and 1-10 wt % of aluminum (Al). A temperature range between a solidus and a liquidus of the magnesium alloy is equal to or larger than 50° C.

Abstract: A process for producing a lithium-containing alloy material is described. The process supplies a light alloy material applicable to the design of lightweight structural components. The process includes first melting alloy materials at a required ratio into a homogeneous alloy melt, then pouring the alloy melt into a ladle protected with an inert gas and pre-filled with a lithium material, where the lithium material is vigorously flushed and mixed with a hot stream of the alloy melt, and diffused into the alloy melt, and then after uniformly mixing, pouring the lithium-containing alloy melt into a mold to form an ingot and produce a lithium alloy. The process solves the fundamental problems of both contamination and uncontrolled component caused by longtime overheat in traditional melting techniques, and is a novel, safe, economic, and efficient manufacture process.