Patents Assigned to AMP Japan
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Patent number: 6478596Abstract: A semiconductor component mounting apparatus for mounting a semiconductor component to test the electric characteristics of the semiconductor component, comprising: a contactor 20 with which the semiconductor component contacts; a substrate 30 which supplies an electric signal to the contractor 20; a plurality of connection components 40, each of which has an electric terminal 48 for supplying the electric signal to the substrate 30 and which is fixed to the substrate 30; a plurality of connectors 50 which has a contact pin 70 including a contact part 74 for contacting with the electric terminal 48 of the connection component 40, a housing 68 for holding the contact pin 70, a pushing apart 78 for pushing the contact pin 70 to the electric terminal 48, and which is freely-detachably connected to one of the plurality of the connection components 40; a holder 80 which holds the plurality of the connectors 50; and a fixing part 86 which fixes the holder 80 to the substrate 30, wherein the contact part 74 slides aType: GrantFiled: January 16, 2002Date of Patent: November 12, 2002Assignees: Advantest Corporation, AMP (Japan) Ltd. IInventors: Kenji Yoshida, Takashi Naito, Shigeru Murayama, Katsuhiko Sakamoto, Takashi Masaki
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Patent number: 6390860Abstract: A connector includes a vibration preventing piece is provided on the side surface of a connecting section between an elongated tab-shaped contact section provided at one end of a connecting terminal and a locking section at the middle, in such a manner that it is flush with the side surface of the locking section and extended towards the tab-shaped contact section. A contact recess is formed in the contact section engaging hole which is formed in the contact section engaging hole which is formed in a housing, so that, when the connecting terminal is inserted into the terminal accommodating chamber, the vibration preventing piece of the connecting terminal is abutted against the contact recess in the contact engaging hole.Type: GrantFiled: October 15, 1999Date of Patent: May 21, 2002Assignees: Yazaki Corporation, AMP (Japan), Ltd.Inventors: Kouichi Shirouzu, Kei Sato, Satoru Shindoh, Hidehisa Yamagami
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Patent number: 6364683Abstract: A locking device (20) is placed on an upper surface of housing (2) of connector (1) in a temporary retained state. The locking device (20) has a pair of beams (78) extending downward obliquely to each other and having notches (78a) in surfaces facing each other. The notches have shoulders which engage against a wedge-shaped rib (90) of the housing (2); the shape of the notches (78a) corresponds to the shape of the rib (90). Therefore, the locking device (20) cannot be inserted in the housing even by force. When mating connector (200) is coupled with connector (1), rib (230) spreads the beams (78) releasing the engagement between the notches (78a) and the rib (90), thus making it possible to insert the locking device (20) to a fully-engaged position.Type: GrantFiled: November 29, 1999Date of Patent: April 2, 2002Assignee: AMP JapanInventor: Toshiaki Kohno
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Patent number: 6305976Abstract: An electrical connector (1) for circuit board installation is provided using solder pegs (60) to reduce the mounting area. Mounting holes (40) for insertion of solder pegs (60) are provided, along the side walls (36), on both sides of the housing (2) of the electrical connector (1) to be installed on a circuit board (30). The mounting holes (40) are formed perpendicular to the circuit board (30), from the top wall (18) of the housing (2) toward the bottom wall (34). The mounting holes (40) are connected to the mating aperture (6) of the connector (1), and are opened to the outside via the bottom part of the side walls (36). When the solder pegs (60) are inserted into the mounting holes (40) and the connectors are mated, a mating connector is guided by a solder peg face (61) of the solder pegs (60).Type: GrantFiled: April 7, 2000Date of Patent: October 23, 2001Assignee: AMP (Japan), Ltd.Inventors: Junya Tsuji, Takashi Futatsugi
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Patent number: 5213515Abstract: An electrical connector includes a housing (12) having a horizontal mounting surface (14) and a plurality of closely spaced contacts (25, 26) with portions (25c, 26c) that are solderable to the conductive traces on a printed circuit board surface. A separable plate (30) is affixed to the housing and includes channels (32) receiving the portions (25c, 26c) to precisely position such portions for soldering to the board traces. Member (30) can be thereafter removed from housing (12) to allow full inspection of the solder joints formed during the soldering operation.Type: GrantFiled: January 15, 1992Date of Patent: May 25, 1993Assignee: AMP (Japan) Ltd.Inventors: Shigeru Ishikawa, Yoshitsugu Fujiura