Patents Assigned to AMPEERS LLC
  • Patent number: 11901097
    Abstract: A round superconductor wire and method for fabricating same are disclosed. Embodiments are directed to a round superconductor wire including at least two superconductor tapes wound on a wire former. Each superconductor tape includes: bottom stabilizer and silver layers; substrate disposed above the bottom silver layer; buffer film stack disposed above the substrate; superconductor film disposed above the buffer film stack; top silver layer disposed above the superconductor film; and top stabilizer layer disposed above the top silver layer. At least one of the bottom stabilizer layer, bottom silver layer, substrate, buffer film stack, superconductor film, top silver layer, or top stabilizer layer is of a different width, thickness, or material composition in one of the superconductor tapes than in another of the superconductor tapes. These and other embodiments achieve a round superconductor wire having improved current density in high magnetic field applications when made in small diameters.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: February 13, 2024
    Assignees: University of Houston System, AMPEERS LLC
    Inventors: Goran Majkic, Anis Ben Yahia, Wenbo Luo, Venkat Selvamanickam, Soumen Kar