Abstract: A QSFP receptacle includes a grounding plate in the housing between the first and second contact arrays such that the first and second contact arrays are equidistant from the grounding plate and a noise cancellation member making electrical contact with the grounding contacts of the first and second contact arrays and the grounding plate to provide an electrical connection among the grounding contacts of the first and second contact arrays and the grounding plate.
Type:
Grant
Filed:
January 14, 2011
Date of Patent:
March 27, 2012
Assignee:
Amphenol Canada Corporation
Inventors:
Zlatan Ljubijankic, Adrian Green, Alex Persaud