Abstract: An interposer assembly including a plate and a plurality of conductive contacts extending through plate passages for forming electrical connections with pads on overlying and underlying substrates.

Abstract: An interposer assembly including a plate and a plurality of metal contacts extending through passages in the plate for forming electrical connections with pads on overlying and underlying substrates. The contacts include a number of contact units with elastic cantilever and torsion springs. Current flows through the contact units with minimum resistance.

Abstract: The application discloses an improved interposer assembly with a molded plastic plate and stamp-formed metal contacts inserted in through passages in the plate. The contacts have redundant separate metal circuit paths extending between opposed contact points to reduce inductance and contact resistance.

Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may be formed to have a large area to form an impedance shield for reducing impedance between adjacent signal contacts. Plastic bodies may be overmolded on separate contacts or on contact pairs and may have sliding fits in passages of the interposer plate. Contacts may be arranged as differential pairs with ground contacts located between the differential pairs.

Abstract: The disclosure relates to interposer assembly plates with large numbers of closely spaced contact apertures extending through the plates and contact members inserted into and retained in the apertures.

Abstract: An interposer plate assembly having an insulating plate and metal contacts in the plate with contact points above and below the plate and a central portion in the plate. Two cantilever arms extend from the central portion to each contact point. The central portion may form an impedance shield for reducing impedance between adjacent signal contacts.

Abstract: The disclosure relates to interposer assembly plates with large numbers of closely spaced contact apertures extending through the plates and contact members inserted into and retained in the apertures.