Abstract: A probe card for testing semiconductor chips on a semiconductor wafer, includes a circuit board receiving electrical signals from outside, a plurality of unit probe modules contacting the semiconductor chips on the wafer to transfer the electrical signals, a space transformer having the plurality of probe modules seated on the upper portion thereof and electrically connected to the circuit board, wherein the respective probe modules are arranged at intervals from each other on the space transformer and the space transformer has vertical apertures penetrating through it up and down, and at least one vertical conductive medium electrically connecting the respective unit probe modules and the circuit board, wherein the vertical conductive medium is arranged in the vertical apertures provided in the space transformer and the respective unit probe modules are arranged at positions spaced from the vertical conductive medium.

Abstract: The present invention is to provide a micro cantilever-type probe disposed on a probe card, having such appropriate elasticity and mechanical strength that the probe would recover its unforced shape after deformation during an inspection and maintain its original shape even after three hundred thousand uses. The present invention provides a probe card which has an electrically insulated substrate fixed on a circuit board; a plurality of elastic probes with a sharpened end fixed on the insulated substrate; and wiring formed on the probe, the insulated substrate and the circuit board. The inventive probe is manufactured by patterning a substrate using photolithography and etching a portion except a pattern-defined portion. The probe is coated by metal layer(s).

Abstract: The present invention is to provide a micro cantilever-type probe disposed on a probe card, having such appropriate elasticity and mechanical strength that the probe would recover its unforced shape after deformation during an inspection and maintain its original shape even after three hundred thousand uses. The present invention provides a probe card comprising an electrically insulated substrate fixed on a circuit board; a plurality of elastic probes with a sharpened end fixed on the insulated substrate; and wiring formed on the probe, the insulated substrate and the circuit board. The inventive probe is manufactured by patterning a substrate using photolithography and etching a portion except a pattern-defined portion. The probe is coated by metal layer(s).