Patents Assigned to AMTECH GROUP LIMITED INDUSTRIAL ESTATE
  • Patent number: 10977542
    Abstract: Metal layers of a smartcard may be provided with slits overlapping at least a portion of a module antenna in an associated transponder chip module disposed in the smartcard so that the metal layer functions as a coupling frame. One or more metal layers may be pre-laminated with plastic layers to form a metal core or clad subassembly for a smartcard, and outer printed and/or overlay plastic layers may be laminated to the front and/or back of the metal core. Front and back overlays may be provided. Pre-laminated metal layers having an array of card sites, with each position having a defined area prepared for the later implanting of a transponder chip module characterized by different sized perforations and gaps around this defined area adjacent to the RFID slit(s), to facilitate the quick removal of the metal in creating a pocket to accept a transponder chip module.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: April 13, 2021
    Assignee: AMTECH GROUP LIMITED INDUSTRIAL ESTATE
    Inventors: Mustafa Lotya, Darren Molloy, David Finn