Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.

Abstract: A semiconductor package is provided for carrying a sleeve member and a fan wheel axially coupled to the sleeve member so as to provide a heat dissipating function. The semiconductor package includes: a substrate; a coil module and at least an electronic component disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the coil module and the electronic component so as to prevent the coil module and the electronic component from disturbing air flow generated by the fan wheel during operation, thereby avoiding generation of noises or vibrations.

Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.