Abstract: A driving device with correction function is provided herein and utilizes a sensing resistor to detect the variation in an operation amplifier. A signal generated by an offset voltage correction circuit is fed back to the operation amplifier and the offset voltage of the abnormal input in the operation amplifier is corrected to be zero so as to keep the operation amplifier under the best performance condition. The driving device implements in the wireless charger driving system can enhance the accuracy of the current value and can achieve good output performance and better system stability.

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.

Abstract: A motor driver IC with auto calibration function is provided, the motor driver IC utilizes a Hall sensor of a switched sensor circuit to detect the changes in an external magnetic field. By using the compensation current which is generated by the automatic calibration circuit to correct the unexpected offset existed in the Hall sensor of the sensing unit itself to zero so that the sensing unit can sense the changes in the external magnetic field accurately and can point out the rotor position correctly, and the motor can be further driven to commutate relatively to reduce the motor rotation noise to achieve good output performance of the motor rotation and the better motor driving system stability.

Abstract: A motor driver IC with auto calibration function is provided, the motor driver IC utilizes a Hall sensor of a switched sensor circuit to detect the changes in an external magnetic field. By using the compensation current which is generated by the automatic calibration circuit to correct the unexpected offset existed in the Hall sensor of the sensing unit itself to zero so that the sensing unit can sense the changes in the external magnetic field accurately and can point out the rotor position correctly, and the motor can be further driven to commutate relatively to reduce the motor rotation noise to achieve good output performance of the motor rotation and the better motor driving system stability.

Abstract: A motor driving device and a driving method thereof is disclosed herein and comprises a PWM converting circuit, an oscillator, a comparator, a controlling unit. The PWM converting circuit converts an analog signal according to an adjustable the highest setting voltage, an adjustable the lowest setting voltage and a controlling signal. The analog signal and a triangular signal generated by the oscillator are inputted to the comparator to compare to output a drive signal to the controlling unit so as to control the motor speed. The motor driving device in the present invention can adjust the motor rotating speed curve to set the lowest rotating speed of the motor so as to achieve the function of changing the motor rotating speed and maintain the lowest torque of the motor to increase the flexibility of the motor speed control.

Abstract: A motor driving apparatus is disclosed herein and includes a control unit, a soft-start unit and an output unit. When power-up or lock release situation, an external PWM driving signal is inputted to the soft-start unit, the soft-start unit generates an internal PWM driving signal and a power-up initial signal; after the power-up initial signal is generated, the control unit transmitting a motor rotation signal to the soft-start unit; when the soft-start unit counts a plurality of the motor rotation signal, the soft-start unit selects the external PWM driving signal or the internal PWM driving signal to output to the output unit.

Abstract: A heat dissipating device includes a semiconductor packaging structure having a stator set and a semiconductor element provided therein, a fan wheel set pivotally connected to the semiconductor packaging structure, and a guiding structure having a guiding channel. The guiding structure receives the semiconductor packaging structure and the fan wheel set. The fan wheel set includes a plurality of blades located above the surface of the semiconductor packaging structure. The stator set and the semiconductor element controls the first blades. The blades extend beyond side surfaces the semiconductor packaging structure and have their sizes increased, such that the airflow volume can be increased without changing the size of the semiconductor packaging structure.

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract: A semiconductor package is provided for carrying a sleeve member and a fan wheel axially coupled to the sleeve member so as to provide a heat dissipating function. The semiconductor package includes: a substrate; a coil module and at least an electronic component disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the coil module and the electronic component so as to prevent the coil module and the electronic component from disturbing air flow generated by the fan wheel during operation, thereby avoiding generation of noises or vibrations.

Abstract: A motor driving device and a driving method thereof is disclosed herein and comprises a PWM converting circuit, an oscillator, a comparator, a controlling unit. The PWM converting circuit converts an analog signal according to an adjustable the highest setting voltage, an adjustable the lowest setting voltage and a controlling signal. The analog signal and a triangular signal generated by the oscillator are inputted to the comparator to compare to output a drive signal to the controlling unit so as to control the motor speed. The motor driving device in the present invention can adjust the motor rotating speed curve to set the lowest rotating speed of the motor so as to achieve the function of changing the motor rotating speed and maintain the lowest torque of the motor to increase the flexibility of the motor speed control.

Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.

Abstract: A pulse width modulation (PWM) module is configured to adjust the input PWM control signal and the motor can be implemented in different rotation speed to enhance the flexibility of the implementation of the motor when the PWM control signals are the same. In addition, the PWM modulation block in the present invention includes a PWM direction control circuit, a PWM vector transfer circuit and a PWM signal generation circuit. Apparently, the PWM modulation block of the present invention is connected to a PWM control signal inputted by an external system and an external adjustment apparatus; by setting up the adjustment apparatus, the vector and the modulation direction of the PWM control signal can be adjusted, and the duty cycle of the PWM control signal can also be adjusted.

Abstract: A method of the Pulse Amplitude Modulation for the Sensorless Brushless motor, which includes a start-up circuit, a phase detect circuit, a phase commutation circuit, a driving circuit, BEMF detection circuit, and frequency detector, utilizes the control signal of the phase commutation circuit to control the driving circuit so as to drive the outer motor coil and detect the control signal for the driving motor driving circuit by a detection circuit. The motor system can be controlled to reduce the discharge speed to avoid the motor driving circuit shutdown and further speed up the start-up time for the next charging period of the motor driving circuit to achieve the effect of low speed rotation and power saving.

Abstract: A semiconductor package is provided for carrying a sleeve member and a fan wheel axially coupled to the sleeve member so as to provide a heat dissipating function. The semiconductor package includes: a substrate; a coil module and at least an electronic component disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the coil module and the electronic component so as to prevent the coil module and the electronic component from disturbing air flow generated by the fan wheel during operation, thereby avoiding generation of noises or vibrations.

Abstract: An anti-noise method for the Direct Current Brushless motor System, which includes a startup circuit, phase detective circuit, motor phase commutation circuit, driving circuit, BEMF detective circuit, and frequency detector, utilizes the BEMF detective circuit to detect the BEMF induced from the coils of the outer motor, and utilizes the sampled voltage phase to determine rotation speed and phase of the external motor by the phase detection circuit and frequency detector. Further, the sampling voltage of the BEMF detection circuit is feedback controlled by the frequency detector, utilized to keep good BEMF to noise ratio, and avoids the BEMF sampling error from the system.

Abstract: A brushless DC motor driving system, in which the duty cycle of the PWM control signals for the duty cycle generator is determined by a speed control circuit, a feedback comparator, and the set and reset signals of a S-R Flip-Flop, wherein the PWM control signals pass through the Hall synthesis circuit, the logic control circuit to drive the coil by the drive current generated, and the duty cycle of the PWM control signals is further adjusted by means of the feedback sensing voltage obtained from the driving current and sensing resistance and fed back to the feedback comparator, the stability and linear stability of the input voltage and the driving current being achieved.

Abstract: A semiconductor package includes: a substrate having a first surface and a second surface opposing the first surface, the first surface having a fan placement zone, a hole and a ventilation hole penetrating the substrate formed at the fan placement zone of the substrate; an electronic component disposed on the first surface surrounding the fan placement zone, the electronic component electrically connected to the substrate; an encapsulant formed on the electronic component and the first surface of the substrate, the encapsulant having an encapsulant opening exposing the fan placement zone; and a fan unit disposed in the encapsulant opening and electrically connected to the substrate. Since the electronic component is disposed on the substrate outside the fan placement zone, heat generated by the electronic component can efficiently dissipate while damage problems of over heat will not occur, and the overall height of the fan unit can thus be decreased.