Patents Assigned to An Wei Enterprise Co., Ltd
  • Patent number: 11471930
    Abstract: A molding die structure for forming oblique teeth on a rivet nut includes a mold seat, a first forging die, a second forging die, and a retaining member. The mold seat is provided with a mold cavity and a threaded portion. The first forging die is inserted into the mold cavity and provided with a die cavity and a nut cavity. The second forging die is inserted into the die cavity and has an inner face provided with an oblique toothed portion and a guide hole. The oblique toothed portion includes a plurality of oblique teeth. The retaining member is screwed into the threaded portion and limits the first forging die and the second forging die in the mold cavity. The second forging die and the die cavity of the first forging die form a low friction contact.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: October 18, 2022
    Assignee: Wei In Enterprise Co., Ltd.
    Inventor: Ming-Che Kuo
  • Patent number: 4804193
    Abstract: An electronic dartboard which includes a circuit board having a plurality of contacts and a dart-engaging target assembly mounted in front of the circuit board. The target assembly has a plurality of individual scoring blocks. Each block has at least one stem rearwardly protruding towards the circuit board. A conductor point and a buffer ring are provided at the back end of the stem. The buffer ring spaces the conductor point from the contact point. When a dart is thrown on the dartboard the buffer ring deforms engaging the conductor point with the contact point.
    Type: Grant
    Filed: September 21, 1987
    Date of Patent: February 14, 1989
    Assignees: An Wei Enterprise Co., Ltd, Cortina International Corp.
    Inventors: Jui S. Lin, Daniel Lin