Abstract: A movable microstructure includes a first finger set comprising two or more first fingers affixed to a substrate and extending substantially parallel to a defined displacement axis towards a proof-mass. The movable microstructure further includes a second finger set comprising at least one second finger, each member of the second finger set extending substantially parallel to the displacement axis from the proof-mass, terminating between two first fingers. Each second finger is substantially closer to one of the two first fingers between which it terminates. The first finger set, in conjunction with the second finger set, form two terminals of a capacitor. An electrical circuit is included that provides a voltage across the capacitor to generate a position-dependent force, the position-dependent force having a component along an axis substantially orthogonal to the displacement axis, the magnitude of the position-dependent force varying in proportion to displacement along the displacement axis.

Abstract: A position-sense interface with improved transfer characteristics. Electrical position detection circuitry, which may be substantially time-multiplexed or frequency-multiplexed, comprises a differential charge integrator with input-sensed output-driven common mode feedback. By placing sense capacitors in the feedback loop of said differential charge integrator with input-sensed output-driven common mode feedback, improved position sensing linearity is attained. In some embodiments of the invention, a compensating charge is applied to the sense capacitors in a fashion that minimizes the output common mode shift of the opamp. The magnitude of the compensating charge may be preset at a substantially constant level, or derived by a feedback loop that measures the shift in output common mode voltage in response to an excitation signal and adjusts the magnitude of the compensating charge to drive said shift towards zero.

Abstract: A microfabricated device includes a substrate having a device layer and substantially filled, isolating trenches; a doped region of material formed by photolithographically defining a region for selective doping of said device layer, selectively doping said region, and thermally diffusing said dopant; circuits on said device layer formed using a substantially standard circuit technology; and at least one structure trench in the substrate which completes the definition of electrically isolated micromechanical structural elements.

Abstract: A method of fabricating MicroElectroMechanical systems. The method includes: providing a substrate in which electrical interconnections and a sacrificial layer have been formed, forming a release mask including germanium, etching exposed sacrificial material, and removing the release mask. The performance of MicroElectroMechanical devices is improved by 1) integrating electronics on the same substrate as the mechanical elements, 2) increasing the proximity of electronics and mechanical elements, 3) increasing the undercut of a release etch to reduce or eliminate etch holes or to allow circuit elements to be undercut, 4) increasing the yield and reliability of the MEMS release processes. In addition to released mechanical structures, the invention also provides a means for forming circuits such as a bandgap reference as a released MEMS element.

Abstract: A microstructure and method for forming the microstructure are disclosed. The method includes: providing a handle substrate; providing a device substrate in which high-aspect-ratio structures and optional integrated circuitry will be fabricated; forming one or more filled isolation trenches within a recessed cavity on a first surface of the device substrate or alternatively forming one or more filled isolation trenches on a first surface of the device substrate and forming a recessed cavity on a first surface of the handle substrate; bonding the first surface of the device substrate to the first surface of the handle substrate; removing a substantially uniform amount of material from the second surface of the device substrate to expose at least one isolation trench; optionally forming circuits and interconnection on a second surface of the device substrate; and etching a set of features in the second surface of the device substrate to complete the definition of electrically isolated structural elements.

Abstract: A micromechanical, dithered device comprising a substrate, a movable mass connected to the substrate by a suspension, a position sensor, a dither signal generator, a dither force transducer connected between the substrate and the movable mass, the input of the dither force transducer being connected to the output of the dither signal generator and a calculator taking as inputs at least the position sensor output and the dither signal generator output. In one embodiment of the invention, the dithered device includes an electrostatic force transducer for applying feedback. In this embodiment, dither force may be directly applied to the mechanical proof-mass utilizing electrostatic structures similar to electrostatic structures used for feedback. The electrostatic dithering structures provide good matching between the feedback and dither electrodes, enabling the use of simple logic for subtraction of the dither signal from the accelerometer output.

Abstract: The invention is directed to a microfabricated device. The device includes a substrate that is etched to define mechanical structures at least some of which are anchored laterally to the remainder of the substrate. Electrical isolation at points where mechanical structures are attached to the substrate is provided by filled isolation trenches. Filled trenches may also be used to electrically isolate structure elements from each other at points where mechanical attachment of structure elements is desired. The performance of microelectromechanical devices is improved by 1) having a high-aspect-ratio between vertical and lateral dimensions of the mechanical elements, 2) integrating electronics on the same substrate as the mechanical elements, 3) good electrical isolation among mechanical elements and circuits except where electrical interconnection is desired.