Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.

Abstract: A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.

Abstract: An approach to modifying bias in a circulator to prevent higher order modes that involves the use of features positioned near the ferrite material of the circulator. The ferrite bias in the perimeter of the ferrite material is modified by the adjacent features such that higher order modes cannot be sustained. The features may include scallops that create a non-uniform magnetic field towards the perimeter of the ferrite while leaving the field near-uniform in the center where the fundamental circulator mode primarily resides. Alternatively, slots may be placed in the magnetically conductive housing bottom in the region of the edge of the ferrite material to prevent higher order modes.

Abstract: A power divider capable of implementation in a compact multilayer surface mount component to perform power division/combining with low insertion loss, wide bandwidth, design flexibility and high power handling capabilities. The power divider has a first pair of coupled transmission lines interconnecting the input to the outputs, a second pair of coupled transmission lines interconnecting the output ports to grounded isolation resistors, and a single transmission line interconnecting the second pair of coupled transmission lines. The surface mount implementation is by a first layer supporting the ports, a second layer providing edge coupled lines, a third layer having ground plane, a fourth layer and a fifth layer each supporting one of a pair of broadside coupled lines, a sixth layer with another ground plane, and a seventh layer including a single line interconnecting the broadside coupled lines.

Abstract: An approach for protecting the circuit trade of a printed circuit board from oxidation that may occur due the permeability of the underlying substrate. A layer of silver is positioned between the circuit trace and the substrate, such as by immersion plating, during manufacturing of the printed circuit board. The layer of silver is preferably applied over the seed-conductor after a negative photo resist layer has been applied to the substrate and before the copper is plated to form the circuit trace. The resist and seed-conductor outside of the circuit trace may then be removed to leave the protected circuit trace. An additional layer of silver may be plated over the copper trace to protect the exterior and side surface of the trace.

Abstract: The present invention is directed to an RF termination device that includes a substrate having a first meandered transmission line disposed on a first surface thereof. The meandered first transmission line has a predetermined first transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the first meandered transmission line is configured as an open circuit. A second meandered transmission line is disposed on the first major surface adjacent the first meandered transmission line. The meandered second transmission line has a predetermined second transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the second meandered transmission line is coupled to the other end of the first transmission line and the other end is coupled to ground.

Abstract: An electrical component, such as an RF device or thermal bridge, for use with a printed circuit board. The component has a first dielectric layer having a top and a bottom, a first conductive trace positioned on the bottom of the dielectric layer, and a first ground layer positioned on the bottom of the dielectric layer and spaced apart from the first conductive trace. For RF applications, a second conductive trace is positioned on top of first dielectric, a second dielectric is positioned on top of the second conductive trace, and a second ground plane is positioned on top of the second dielectric. A printed circuit board having a third conductive trace may then be coupled to the first conductive trace by a first solder layer.

Abstract: The present invention is directed to an impedance matching network for use at a predetermined frequency.

Abstract: The present invention is directed to an RF termination device that includes a substrate having a first meandered transmission line disposed on a first surface thereof. The meandered first transmission line has a predetermined first transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the first meandered transmission line is configured as an open circuit. A second meandered transmission line is disposed on the first major surface adjacent the first meandered transmission line. The meandered second transmission line has a predetermined second transmission line length and a characteristic impedance substantially equal to twice the predetermined system impedance. One end of the second meandered transmission line is coupled to the other end of the first transmission line and the other end is coupled to ground.

Abstract: An approach to modifying bias in a circulator to prevent higher order modes that involves the use of features positioned near the ferrite material of the circulator. The ferrite bias in the perimeter of the ferrite material is modified by the adjacent features such that higher order modes cannot be sustained. The features may include scallops that create a non-uniform magnetic field towards the perimeter of the ferrite while leaving the field near-uniform in the center where the fundamental circulator mode primarily resides. Alternatively, slots may be placed in the magnetically conductive housing bottom in the region of the edge of the ferrite material to prevent higher order modes.

Abstract: A device includes a thermally conductive and electrically insulative substrate having a first major surface and a second major surface. A coupling structure is configured to reduce the RF input signal by substantially a predetermined amount of attenuation power. A tuning circuit is characterized by a tuning reactance substantially matched to a predetermined system impedance. A resistor is disposed on a majority of the first major surface and is characterized by a parasitic capacitance that is substantially negated by the tuning reactance. The resistor includes a first resistive portion and a second resistive portion; each of the first resistive portion and the second resistive portion being configured to direct approximately one-half of the attenuation power to the ground portion.

Abstract: An RF device includes an impedance transformation circuit having a plurality of first RF couplers. Each first RF coupler includes a first portion of a first transmission line winding disposed on at least one first printed circuit board (PCB) and is configured to be electromagnetically coupled to a first portion of a second transmission line winding disposed on at least one second printed circuit board (PCB). The RF device also includes a balun circuit includes a plurality of second RF couplers coupled to balanced port connections, each second RF coupler including a second portion of the first transmission line winding wound around the first portion of a first transmission line winding and configured to be electromagnetically coupled to a second portion of the second transmission line winding wound around the first portion of a second transmission line winding.

Abstract: An RF device includes an impedance transformation circuit having a plurality of first RF couplers. Each first RF coupler includes a first portion of a first transmission line winding disposed on at least one first printed circuit board (PCB) and is configured to be electromagnetically coupled to a first portion of a second transmission line winding disposed on at least one second printed circuit board (PCB). The RF device also includes a balun circuit includes a plurality of second RF couplers coupled to balanced port connections, each second RF coupler including a second portion of the first transmission line winding wound around the first portion of a first transmission line winding and configured to be electromagnetically coupled to a second portion of the second transmission line winding wound around the first portion of a second transmission line winding.

Abstract: A device includes a thermally conductive and electrically insulative substrate having a first major surface and a second major surface. A coupling structure is configured to reduce the RF input signal by substantially a predetermined amount of attenuation power. A tuning circuit is characterized by a tuning reactance substantially matched to a predetermined system impedance. A resistor is disposed on a majority of the first major surface and is characterized by a parasitic capacitance that is substantially negated by the tuning reactance. The resistor includes a first resistive portion and a second resistive portion; each of the first resistive portion and the second resistive portion being configured to direct approximately one-half of the attenuation power to the ground portion.

Abstract: A self-cascadable phase shifter having a two corresponding pairs of input and output pins. Each pair of input and output pins are interconnected by phase delay circuitry that is isolated from phase delay circuitry interconnecting the other pair of input and output pins so that each pair of input and output pins produces, for example, a 90 degree phase shift. The resulting phase shifter can be used to produce a 90 degree by using one pair of input and output pins or cascading both pairs of input and output pins to provide a 180 degree delay.

Abstract: A computer implemented system and method for locating a user have been envisaged. The system, in accordance with the embodiments herein includes a handheld device configured to identify the present location of the user, along with the audiovisual information corresponding to the identified location of the user. The handheld device transmits that location information and the audiovisual information to a centralized server, only in the event that the user performs a predetermined gesture. Subsequently, the centralized server processes the location information and the corresponding audiovisual information, and identifies at least one electronic communication device accessible to at least one of rescue personnel, and subsequently transmits the location information and the audiovisual information, to the identified electronic communication device, preferably along with an SOS message.

Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Abstract: The present invention is directed to a stripline assembly that includes a first pre-fired ceramic substrate including a ground plane disposed on a first surface of the first pre-fired ceramic substrate. A second pre-fired ceramic substrate includes a ground plane disposed on a first surface thereof and a circuit disposed on a second surface of the second pre-fired ceramic substrate opposite the first surface. The circuit is disposed between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate. A conductive bonding layer is disposed around the periphery of the circuit and between the first pre-fired ceramic substrate and the second pre-fired ceramic substrate.

Abstract: The present invention is directed to an RF device that includes a laminate structure having a ceramic layer having a predetermined thermal conductivity that is a function of a predetermined RF device operating temperature. The ceramic layer forms a first major surface of the laminate structure and a second major ceramic surface is bonded to a layer of thermoplastic material that is, in turn, bonded to a conductive layer. The thermoplastic material has a coefficient of thermal expansion that substantially matches the conductive layer. A first circuit arrangement is disposed on the first major surface of the laminate structure and it includes a first RF circuit structure having a predetermined geometry and predetermined electrical characteristics. The laminate structure is configured to dissipate thermal energy generated by the at least one first RF circuit structure via substantially the entire second major surface of the laminate structure.

Abstract: The present invention is directed to a hybrid coupler device that includes a first transmission line structure and a second transmission line structure. The first transmission line structure is interdigitally coupled with the second transmission line structure such that each transmission line in the second transmission line structure is disposed adjacent to a transmission line in the first transmission line structure. The coupling or the mutual capacitance Cd between the transmission lines of the present invention need not be equal; in fact, they all can be different.