Abstract: A sensor assembly includes a replaceable sensor module and an assembly housing. The assembly housing contains an assembly housing processor and an electrical connector connected to the processor. The replaceable sensor module has an enclosure adapted to be mounted in a position to sense a process variable, a process variable transducer positioned in said enclosure so as to be exposed to the process variable, and a non-volatile memory having stored therein specific profiling data for the sensor module. The assembly housing processor has data representing a desired sensor assembly output characteristic, and is responsive to receipt of specific profiling data and to the data representing the desired sensor assembly output characteristic to calibrate the sensor assembly to provide the desired sensor assembly output characteristic when connected to the sensor module having the specified profiling data. Radial and axial seals are provided for the openings in the assembly housing.

Abstract: An electronic thermometer for use in food and dairy processing is disclosed. The thermometer utilizes a passive trimming circuit in conjunction with high quality Resistive Temperature Devices (RTDs), along with four-wire measurement circuitry to create an extremely accurate signal so that all probes are interchangeable and require no adjustment to maintain accuracy. The current source is modulated to linearize the RTDs response over a broad temperature range. To substantially eliminate the possibility of false temperature readings, dual RTDs and redundant electronic circuitry are employed, along with a detection circuit which will blank out the display should an error be detected. To prevent undue display blanking, a rapid temperature change sensing circuit will temporarily override the display blanking feature.