Abstract: An optical device that includes an input region, an output region, and an arrayed waveguide grating between the input region and the output region is presented. The input region includes a first input waveguide set and a second input waveguide set, and the output region includes a first output waveguide set and a second output waveguide set. The arrayed waveguide grating is shared by the signals that travel from the input region to the output region. The device is capable of simultaneously functioning as a multiplexer and a demultiplexer, thereby reducing the cost and complexity of a dual-function optical device. Where the arrayed waveguide grating is used for multiplexing, the optical device receives demultiplexed input signals and generates a multiplexed signal. Where the arrayed waveguide grating is used for demultiplexing, the optical device receives a multiplexed input signal and generates a set of demultiplexed signals.

Abstract: A spectrophotometer capable of high spectral resolution (e.g., in the GHz range) is presented. The spectrophotometer includes a container for holding a sample, an arrayed-waveguide grating coupled to the sample holder, and a detector array coupled to the arrayed-waveguide grating. The arrayed-waveguide grating may be a monolithic chip, and the container may be integrated into the chip. An integrated container may be a microfluidic channel formed through the layers in the chip and positioned in such a way that light is transferable from the microfluidic channel to the waveguides of the arrayed-waveguide grating. The invention is also a method of making the spectrophotometer. The method entails providing an arrayed-waveguide grating having an input end and an output end, coupling a container to the input end, wherein the container is capable of holding a sample, and coupling a detector array to the output end of the arrayed-waveguide grating.

Abstract: A method for forming optical devices on-planar substrates, as well as optical devices formed by the method are described. The method uses a linear injection APCVD process to form optical waveguide devices on planar substrates. The method is performed at approximately atmospheric pressure. According to the method, a wafer with a lower cladding layer already formed by either CVD or oxidation is placed on a conveyer, which may include a heating element. The heated wafer is transported underneath a linear injector such that the chemicals from the linear injector react on the wafer surface to form a core layer. After the core layer is formed, photoresist is spun on the surface of the wafer, and then standard lithography is used to pattern the optical devices. Next, reactive ion etching (RIE) is used to form waveguide lines. The remaining photoresist is then removed. An upper cladding layer is formed to substantially cover the core regions.