Abstract: A contact mechanism for connecting the leads of an IC package to an IC tester comprises a carrier block provided with an opening to receive therein an IC package provided with leads on its side surfaces, an IC connector connected to the IC tester, and a shifting mechanism for shifting the IC package received in the opening of the carrier block toward the IC connector after the carrier block has been joined to the IC connector, to bring the leads of the IC package into contact with the corresponding electrodes of the IC connector. The opening of the carrier block is tapered downward so that the leads of the IC package is guided by the inclined side surfaces of the opening as the IC package is pushed down toward the IC connector to position the leads of the IC package correctly relative to the corresponding electrodes of the IC connector.