Patents Assigned to Andrew Cheng of Foxconn International, Inc.
  • Publication number: 20030128524
    Abstract: A mounting assembly includes a mounting bracket (10) having a side panel (14), and a clip (40) attached on the side panel. A pair of through holes (18) is defined in the side panel. The clip includes a press portion (42), and a pair of palms (48) on opposite sides of the press portion. Each palm has barbs (49) extending toward the press portion. When the press portion is inwardly pressed, the clip elastically deforms, the palms move away from each other, and the palms extend through the through holes to be received in corresponding locking holes (32) defined in a corresponding data storage device (30). The barbs firmly engage with the storage device at the locking holes, thereby securing the storage device in the mounting bracket. When the press portion is inwardly pressed again, the storage device is unlocked from the mounting bracket.
    Type: Application
    Filed: January 7, 2002
    Publication date: July 10, 2003
    Applicant: Andrew Cheng of Foxconn International, Inc.
    Inventor: Yun Lung Chen
  • Publication number: 20030015343
    Abstract: A heat sink assembly (10) comprises a heat sink (20) and a clip (30). The heat sink has a base (21) and a plurality of fins (23) extending therefrom. A central receiving groove (25) is defined between two rows of fins. A pair of opposing ridges (24) is formed on each pair of opposing fins which straddle the groove. The clip comprises a main body (31) and opposite legs (38) extending therefrom. The main body has three integrally connected frames (32, 34, 36). Two outer frames are coplanar, and a plane of an intermediate frame is offset away from a plane of the outer frames at an acute angle. The frames are interferentially held in the groove between the ridges, fins and the base. The legs extend in different directions such that the clip is broadly Z-shaped when viewed from above, and broadly V-shaped when viewed from a side thereof.
    Type: Application
    Filed: July 20, 2001
    Publication date: January 23, 2003
    Applicant: Andrew Cheng of Foxconn International, Inc.
    Inventor: Chun-Chi Chen