Abstract: A flip-chip IC package configured for ease of testing comprises a substrate and a plurality of stiffener walls, each stiffener wall carrying an IC, wherein the stiffener walls and ICs are fixed to the substrate with electrical continuity being established between the substrate and the stiffener walls and IC's through conductive bumps (solder bumps or conductive epoxy bumps). The substrate and the stiffener walls include test points on their surfaces, and also include printed electrical circuitry connecting the test points and the conductive bumps. Some of the printed electrical circuitry is arranged to establish paths between test points which facilitate testing of conductivity through the conductive bumps, and which facilitate functional testing of the ICs.

Abstract: A flip-chip IC package configured for ease of testing comprises a substrate and a plurality of stiffener walls, each stiffener wall carrying an IC, wherein the stiffener walls and ICs are fixed to the substrate with electrical continuity being established between the substrate and the stiffener walls and IC's through conductive bumps (solder bumps or conductive epoxy bumps). The substrate and the stiffener walls include test points on their surfaces, and also include printed electrical circuitry connecting the test points and the conductive bumps. Some of the printed electrical circuitry is arranged to establish paths between test points which facilitate testing of conductivity through the conductive bumps, and which facilitate functional testing of the ICs.

Abstract: A process of making a multilayer printed wiring board assembly.