Abstract: A plurality of probes for contacting the pads of an integrated circuit are cantilevered within the aperture of a ceramic ring. The probes are fixed to the ring with an adhesive and a second ceramic ring is positioned on them to support them against contact forces. The probes are soldered to conductive tracks on the first ring for connection to test apparatus, providing a very rigid and dimensionally accurate and stable probe arrangement. The device can be constructed with the probes in contact with a sample integrated circuit, in a quick and simple process.