Abstract: Substantially flat thin foil electrical components, e.g. thin foil resistors, are disclosed wherein a thin metallic foil is bonded to an insulating substrate and a circuit path is formed on the foil by photographic artwork-etching or other techniques. Terminal lands of the circuit are electroplated on the foil connecting leads having paddles or flattened portions formed with a hole or slot therein are soldered to the lands such that the solder extends into the hole or slot. The value of the resistor is finally adjusted by use of a laser beam, at least one bead of rubber is applied on at least a portion of the edges of the substrates, and the resistor is encapsulated.

Abstract: A thin film foil resistor is disclosed wherein a thin metallic foil is bonded to an insulating substrate and a circuit path is formed on the foil by photographic artwork-etching techniques. After the circuit is formed, the structure is subjected to another etching process to reduce the thickness of the foil circuit thereby adjusting the value of the resistor. Terminal lands of the circuit are electroplated and the connecting leads are soldered to the lands. The value of the resistor is finally adjusted by use of a laser beam, and the resistor is encapuslated.

Abstract: A thin film foil resistor is disclosed wherein a thin metallic foil is bonded to an insulating substrate and a circuit path is formed on the foil by photographic artwork-etching techniques. After the circuit is formed, the structure is subjected to another etching process to reduce the thickness of the foil circuit thereby adjusting the value of the resistor. Terminal lands of the circuit are electroplated and the connecting leads are soldered to the lands. The value of the resistor is finally adjusted by use of a laser beam, and the resistor is encapsulated.

Abstract: A thin film, cylindrical resistor is disclosed which exhibits non-inductive characteristics and which may be fabricated easily and economically. A cylindrical insulative substrate is provided with electrically conductive termination bands and a thin coating of electrically resistive material over the entire cylindrical surface. The resistive material is then cut along an axial path and along an interrupted spiral path so as to form the resistive material into a serpentine path along the cylindrical substrate. Leads are attached to each end and as the current traverses the length of the cylinder it travels in a serpentine path. The current travels in opposite directions along adjacent parallel portions of the path thereby cancelling out the major portion of inductance.