Patents Assigned to ANGSTROM ENGINEERING INC.
  • Patent number: 12595553
    Abstract: Described are various embodiments of a system and method for controlling film thickness, and a film deposition system and method using same. In one such embodiments, a vapour deposition system for spatially controlling a deposited film thickness on a substrate comprises: an emission source; a substrate holder; and a translatable shutter comprising a flux barrier disposed between said emission source and the substrate and operable to translate said flux barrier through a deposition flux according to a designated linear translation profile designated to spatially control the deposited film thickness.
    Type: Grant
    Filed: September 5, 2024
    Date of Patent: April 7, 2026
    Assignee: ANGSTROM ENGINEERING INC.
    Inventors: Jonathan Boulanger, David Pitts, Andrew Campbell, Erik Smith, Paul Clarke, Timothy Brenner, Mike Miller, Craig Reynolds