Abstract: Described are various embodiments of a system and method for controlling film thickness, and a film deposition system and method using same. In one such embodiments, a vapour deposition system for spatially controlling a deposited film thickness on a substrate comprises: an emission source; a substrate holder; and a translatable shutter comprising a flux barrier disposed between said emission source and the substrate and operable to translate said flux barrier through a deposition flux according to a designated linear translation profile designated to spatially control the deposited film thickness.
Type:
Grant
Filed:
September 5, 2024
Date of Patent:
April 7, 2026
Assignee:
ANGSTROM ENGINEERING INC.
Inventors:
Jonathan Boulanger, David Pitts, Andrew Campbell, Erik Smith, Paul Clarke, Timothy Brenner, Mike Miller, Craig Reynolds