Abstract: This specification discloses a method and implementations improving the field of holding or mounting Scanning Probe Microscopy probe tips for use and alignment. Specifically, the invention allows probes to be mounted replaceably to a very small SPM actuator and aligned in 5 axis permitting alignment of cantilever to beam and reflected beam to detector. The invention allows for great simplification of SPM design while allowing reduction in sizes and masses of tip mounting apparatus thereby improving performance.

Abstract: A displacement sensor has a graded index multi-mode fiber with a length that is an odd multiple of a quarter pitch length of the graded index multi-mode fiber and a single-mode optical fiber fusion spliced to the first end of said graded index multi-mode fiber. A reflective mirror coating is applied to a planar facet on the second end of said graded index multi-mode fiber. A plurality of mechanical attachments are spaced along the graded index multi-mode fiber and single-mode optical fiber that mechanically deform said graded index multi-mode fiber, when any one of said plurality of mechanical attachments is displaced relative to any other one of said plurality of mechanical attachments.

Abstract: A magnetron sputtering electrode for use in a rotatable cylindrical magnetron sputtering device, the electrode including a cathode body defining a magnet receiving chamber and a cylindrical target surrounding the cathode body. The target is rotatable about the cathode body. A magnet arrangement is received within the magnet receiving chamber, the magnet arrangement including a plurality of magnets. A shunt is secured to the cathode body and proximate to a side of the magnet arrangement, the shunt extending in a plane substantially parallel to the side of the magnet arrangement. A method of fine-tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device is also disclosed.

Abstract: A SPM head incorporates a probe and a cantilever on which the probe is mounted. The cantilever has a planar reflecting surface proximate a free end of the cantilever. The cantilever extends from a mechanical mount and a single-mode optical fiber is supported by the mechanical mount to provide a beam. A micromirror is mounted to reflect the beam substantially 90° to the planar reflecting surface.

Abstract: An adjustable shunt assembly for use with a sputtering magnetron having at least two magnets spaced from one another and disposed with respect to a sputtering target having a sputtering surface. The magnets define a longitudinal axis and the adjustable shunt assembly moves a shunt between the two magnets for altering the magnetic field therebetween. A transporter is used for moving the shunt so that such movement may be occurred without disassembling the components of the magnetron and such movement may also be done remotely. A method for moving such shunts is also disclosed.

Abstract: A SPM head incorporates a probe and a cantilever on which the probe is mounted. The cantilever has a planar reflecting surface proximate a free end of the cantilever. The cantilever extends from a mechanical mount and a single-mode optical fiber is supported by the mechanical mount to provide a beam axis at an angle away from normal relative to the reflecting surface.

Abstract: A magnet arrangement which is usable as both a retrofit magnetic arrangement in a rotatable cylindrical magnetron sputtering electrode as well as a drive assembly in communication with the electrode for delivering high current into a target surface without adding highly incremental cost to the overall design of the electrode. The electrode includes a cathode body defining a magnet receiving chamber, a rotatable cylindrical target surrounding the cathode body, wherein the target is rotatable about the cathode body. The cathode body further defines a magnet arrangement received within the magnet receiving chamber, wherein the magnet arrangement comprised of a plurality of magnets wherein at least one of the magnets is a profiled magnet having a contoured top portion.

Abstract: A magnetron sputtering electrode for use in a rotatable cylindrical magnetron sputtering device, the electrode including a cathode body defining a magnet receiving chamber and a cylindrical target surrounding the cathode body. The target is rotatable about the cathode body A magnet arrangement is received within the magnet receiving chamber, the magnet arrangement including a plurality of magnets. A shunt is secured to the cathode body and proximate to a side of the magnet arrangement, the shunt extending in a plane substantially parallel to the side of the magnet arrangement. A method of fine-tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device is also disclosed.

Abstract: A magnetron plasma apparatus boosted by hollow cathode plasma includes at least one electrically connected pair of a first hollow cathode plate and a second hollow cathode plate placed opposite to each other at a separation distance of at least 0.1 mm and having an opening following an outer edge of a sputter erosion zone on a magnetron target so that a magnetron magnetic field forms a perpendicular magnetic component inside a hollow cathode slit between plates and, wherein the plates and are connected to a first electric power generator together with the magnetron target to generate a magnetically enhanced hollow cathode plasma in at least one of a first working gas distributed in the hollow cathode slit and a second working gas admitted outside the slit in contact with a magnetron plasma generated in at least one of the first working gas and the second working gas.

Abstract: A seal and fixation assembly includes a cylindrical target having an inside surface with a shoulder that forms a stop within the target. A target retaining ring is disposed about the target. A seal plate is disposed within the target and engages the stop and the inside surface of the target. An end cap is disposed on the end of the target and includes a portion with a beveled surface within the target. A sealing element is disposed between the inside surface of the target, the seal plate, and the beveled surface of the end cap. A clamp is disposed over the end cap and the target retaining ring. Engagement of the end cap and the target retaining ring with the clamp causes the end cap to move within the target toward the stop to compress the sealing element between the target, the seal plate, and the beveled surface.

Abstract: An adjustable shunt assembly for use with a sputtering magnetron having at least two magnets spaced from one another and disposed with respect to a sputtering target having a sputtering surface. The magnets define a longitudinal axis and the adjustable shunt assembly moves a shunt between the two magnets for altering the magnetic field therebetween. A transporter is used for moving the shunt so that such movement may be occurred without disassembling the components of the magnetron and such movement may also be done remotely. A method for moving such shunts is also disclosed.

Abstract: A rotatable cylindrical magnetron sputtering device that includes a cathode body defining a magnet receiving chamber and a cylindrical target assembly surrounding the cathode body, wherein the cylindrical target assembly is rotatable around the cathode body. The cylindrical target assembly includes a hollow mandrel and a target portion mounted around and spaced away from the hollow mandrel portion so as to create a space gap between the hollow mandrel and the target portion, wherein the space gap may be greater than 0.002 inch and less than 0.020 inch.

Abstract: A magnetron sputtering electrode for use within a magnetron sputtering device that includes a cathode body, a target receiving area defined adjacent the cathode body, a plurality of magnets received within a magnet receiving chamber and an anode shield surrounding the cathode body. At least a portion of a coolant passageway is defined by the anode shield, whereby the coolant passageway is adapted to receive coolant to circulate therethrough thereby cooling the anode shield.

Abstract: A seal and fixation assembly includes a cylindrical target having an inside surface with a shoulder that forms a stop within the target. A target retaining ring is disposed about the target. A seal plate is disposed within the target and engages the stop and the inside surface of the target. An end cap is disposed on the end of the target and includes a portion with a beveled surface within the target. A sealing element is disposed between the inside surface of the target, the seal plate, and the beveled surface of the end cap. A clamp is disposed over the end cap and the target retaining ring. Engagement of the end cap and the target retaining ring with the clamp causes the end cap to move within the target toward the stop to compress the sealing element between the target, the seal plate, and the beveled surface.

Abstract: A magnetron sputtering electrode for use in a rotatable cylindrical magnetron sputtering device, the electrode including a cathode body defining a magnet receiving chamber and a cylindrical target surrounding the cathode body. The target is rotatable about the cathode body A magnet arrangement is received within the magnet receiving chamber, the magnet arrangement including a plurality of magnets. A shunt is secured to the cathode body and proximate to a side of the magnet arrangement, the shunt extending in a plane substantially parallel to the side of the magnet arrangement. A method of fine-tuning a magnetron sputtering electrode in a rotatable cylindrical magnetron sputtering device is also disclosed.

Abstract: A magnet assembly for a magnetron sputtering device having circular, linear or other types of planar targets including two permanent magnets and an electromagnet, e.g., electromagnetic coil between the permanent magnets associated with a sputtering target of a target assembly. An electrical control circuit is arranged to selectively adjust at least the current level and the direction of current to the electromagnet to alter the magnetic fields of the magnet assembly thereby encompassing the entire portions of the sputtering target, including the extreme inner and outer portions of the sputtering target to optimize the target uniformity and the sputtered film uniformity on a substrate. Methods for operating the magnet assembly of the magnetron sputtering devices, for optimizing the target utilization and sputtered film uniformity on a substrate, and for operating the magnetron sputtering process in a reactive gas environment to form an insulating or dielectric thin film are also provided.

Abstract: A rotatable cylindrical magnetron sputtering device that includes a cathode body defining a magnet receiving chamber and a cylindrical target assembly surrounding the cathode body, wherein the cylindrical target assembly is rotatable around the cathode body. The cylindrical target assembly includes a hollow mandrel and a target portion mounted around and spaced away from the hollow mandrel portion so as to create a space gap between the hollow mandrel and the target portion, wherein the space gap may be greater than 0.002 inch and less than 0.020 inch.

Abstract: A magnet arrangement which is usable as both a retrofit magnetic arrangement in a rotatable cylindrical magnetron sputtering electrode as well as a drive assembly in communication with the electrode for delivering high current into a target surface without adding highly incremental cost to the overall design of the electrode. The electrode includes a cathode body defining a magnet receiving chamber, a rotatable cylindrical target surrounding the cathode body, wherein the target is rotatable about the cathode body. The cathode body further defines a magnet arrangement received within the magnet receiving chamber, wherein the magnet arrangement comprised of a plurality of magnets wherein at least one of the magnets is a profiled magnet having a contoured top portion.

Abstract: A magnetron sputtering electrode for use with a magnetron sputtering device, wherein the magnetron sputtering electrode comprises a cathode body, a drive unit coupled to the cathode body, a target received by the cathode body, and a closed loop magnet arrangement received within a magnet receiving chamber and coupled to the drive unit. The closed loop magnet arrangement is comprised of a plurality of magnets adapted for motion relative to the target by the drive unit, wherein at least one of the plurality of magnets is a profiled magnet having a contoured top portion. A method of improving target utilization in sputtering applications is also disclosed.

Abstract: A magnetron sputtering electrode for use with a magnetron sputtering device, wherein the magnetron sputtering electrode comprises a cathode body, a drive unit coupled to the cathode body, a target received by the cathode body, and a closed loop magnet arrangement received within a magnet receiving chamber and coupled to the drive unit. The closed loop magnet arrangement is comprised of a plurality of magnets adapted for motion relative to the target by the drive unit, wherein at least one of the plurality of magnets is a profiled magnet having a contoured top portion. A method of improving target utilization in sputtering applications is also disclosed.