Patents Assigned to ANJI Microelectronics Co., Ltd.
  • Systems and slurries for chemical mechanical polishing
    Patent number: 7052373
    Abstract: Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.
    Type: Grant
    Filed: January 19, 2005
    Date of Patent: May 30, 2006
    Assignee: ANJI Microelectronics Co., Ltd.
    Inventors: Andy Chunxiao Yang, Chris Chang Yu