Abstract: An apparatus for electroplating selected portions of a strip comprises means for intermittently moving the strip through successive stations. Means are provided at one of the stations for selectively electroplating selected portions of the strip and comprises upper and lower press members which are movable relatively toward and away from one another. An upper mask of resilient material is provided on the upper member and a lower mask of resilient material is provided on the lower member. The lower mask has a plurality of openings therein having the configuration of the selected portion which is to be plated. When the upper and lower members are moved toward one another, the strip is gripped. The lower member has a plurality of openings therein. The openings in the lower member have their lower ends chamfered and extend to a first chamber in the lower member.