Patents Assigned to ANOMAX SDN BHD
  • INTEGRATED PLATED CIRCUIT HEAT SINK AND METHOD OF MANUFACTURE
    Publication number: 20130233600
    Abstract: A method of preparing a non-ferrous metal substrate for plating includes providing an anodized layer on an aluminum substrate and electrically isolating the anodized layer from the non-ferrous metal substrate by applying an electrically non-conductive micro-filler to the anodized layer to form a filled region of the anodized layer electrically isolating the anodized layer from the non-ferrous metal substrate.
    Type: Application
    Filed: June 16, 2011
    Publication date: September 12, 2013
    Applicant: ANOMAX SDN BHD
    Inventor: Ling Ping Ong