Patents Assigned to Anova Solutions, Inc.
  • Patent number: 8005660
    Abstract: An Integrated Circuit Design tool incorporating a Stochastic Analysis Process (“SAP”) is described. The SAP can be applied on many levels of circuit components including transistor devices, logic gate devices, and System-on-Chip or chip designs. The SAP replaces the large number of traditional Monte Carlo simulations with operations using a small number of sampling points or corners. The SAP is a hierarchical approach using a model fitting process to generate a model that can be used with any number of performance metrics to generate performance variation predictions along with corresponding statistical information (e.g., mean, three-sigma probability, etc.). A hierarchical SAP process breaks an overall circuit into a plurality of subcircuits and performs circuit simulation and SAP analysis steps on each subcircuit. An integration and reduction process combines the analysis results of each subcircuit, and a final SPICE/SAP process provides a model for the overall circuit based on the subcircuits.
    Type: Grant
    Filed: June 27, 2007
    Date of Patent: August 23, 2011
    Assignee: Anova Solutions, Inc.
    Inventors: Hsien-Yen Chiu, Meiling Wang, Jun Li
  • Patent number: 7243320
    Abstract: An Integrated Circuit Design tool incorporating a Stochastic Analysis Process (“SAP”) is described. The SAP can be applied on many levels of circuit components including transistor devices, logic gate devices, and System-on-Chip or chip designs. The SAP replaces a large number of traditional Monte Carlo simulations with operations using a small number of sampling points or corners. The SAP is a hierarchical approach using a model fitting process to generate a model that can be used with any number of performance memos to generate performance variation predictions along with corresponding statistical information (e.g., mean, three-sigma probability, etc.). The SAP provides an efficient way of modeling the circuit or system variation due to global parameters such as device dimensions, interconnect wiring variations, economic variations, and manufacturing variations.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: July 10, 2007
    Assignee: Anova Solutions, Inc.
    Inventors: Hsien-Yen Chiu, Meiling Wang, Jun Li