Abstract: An apparatus for recovering solder from solder coated scrap pieces includes a first centrifuge comprising a centrifuge receptacle having perforation holes, rotatably mounted about a first centrifuge axis for containing and rotating a quantity of solder coated scrap pieces. A solder collection container can surround the centrifuge receptacle. A heater can surround the solder collection container for heating the solder coated scrap pieces and melting the solder thereon. A drive system can be configured for rotating the centrifuge receptacle while the first centrifuge axis is in about a horizontal position at a low speed that tumbles the scrap pieces along a longitudinal length of the centrifuge receptacle, and later rotating the centrifuge receptacle at a high speed for centrifugally extracting molten solder from the centrifuge receptacle, radially outwardly through the perforation holes into the solder collection container.

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: A solder composition includes about 4% to about 25% by weight tin, about 0.1% to about 8% by weight antimony, about 0.03% to about 4% by weight copper, about 0.03% to about 4% by weight nickel, about 66% to about 90% by weight indium, and about 0.5% to about 9% by weight silver. The composition can further include about 0.2% to about 6% by weight zinc, and, independently, about 0.01% to about 0.3% by weight germanium. The composition can be used to solder an electrical connector to an electrical contact surface on a glass component.

Abstract: An apparatus for presoldering electrical components can include a die device having a punch member for punching a solder preform from a sheet of solder, and pressing the solder preform against an electrical component. A heating device can press against the electrical component on a opposite side from the die device for sandwiching the electrical component between the punch member and the heating member, for heating the electrical component and melting the solder preform thereon.