Abstract: The present invention relates to a method for manufacturing optical modules comprising the following steps: i) providing a wafer having one or more substrate layers; ii) dicing said wafer into multiple parallel oriented strips; iii) tilting said multiple parallel oriented strips; iv) grinding at least one surface of said tilted, multiple parallel oriented strips; v) bonding said grinded surface of said tilted, multiple parallel oriented strips to at least one substrate; vi) dicing said at least one substrate into optical modules.

Abstract: The present invention relates to method of fabricating a wafer level optical lens assembly. The method includes providing a wafer substrate having a plurality of lens shapes arranged side by side, and providing a spacer substrate having a plurality of spacer posts. The method further includes applying a first polymer liquid on a specific location chosen from the group of: (1) positions located on the wafer substrate between the plurality of lens shapes; (2) positions located on the contact surface of the spacer posts; and (3) a combination thereof. The method further includes contacting the wafer substrate with the spacer substrate such that the spacer posts force the first polymer liquid to flow towards the lens shapes, followed by curing the first polymer liquid, and applying a second polymer liquid onto the lens shapes.

Abstract: The present invention relates to an optical light guide element having a first end section with a light entrance area designed for facing a light source and having a second end section with a light exit area designed for facing a light target area, wherein the light exit area is defined by a second surface area on the optical light guide element which faces a light target area, and wherein the light entrance area is defined by a first surface area on the optical light guide element which faces the light source, wherein the first end section comprises a first inclined surface area which forms an acute angle with the first surface area of the light entrance area, wherein the second end section forms a second inclined surface area which encloses an acute angle with the surface area of the light exit area, characterized in that said first surface area on the optical light guide element which faces the light source comprises a first replicated polymer lens.

Abstract: The present invention relates to a method of fabricating an array of optical lens elements, comprising: providing a first mold having a plurality of recesses; applying a first polymer liquid in said plurality of recesses; providing a first contact shaping substrate; contacting said first contact shaping substrate with said first polymer liquid in said plurality of recesses, wherein said contact between said first contact shaping substrate and said first polymer liquid results in a deformation of the contour configuration of said first polymer liquid facing away from said plurality of recesses; curing said first polymer liquid to form an array of optical lens elements.

Abstract: The present invention relates to method of fabricating a wafer level optical lens substrate. The method comprising providing a first wafer substrate having a plurality of bumps, applying a first polymer liquid on a first contact optical surface of said plurality of bumps, providing a second wafer substrate, and contacting said first wafer substrate with said second substrate in such that said first polymer liquid is located in a slit created between said first contact optical surface of said plurality of bumps and said second wafer substrate under capillary forces. The method comprises thereafter curing said polymer liquid(s) to form a lens.

Abstract: The present invention relates to method of fabricating a wafer level optical lens substrate. The method comprising providing a first wafer substrate having a plurality of bumps, applying a first polymer liquid on a first contact optical surface of said plurality of bumps, providing a second wafer substrate, and contacting said first wafer substrate with said second substrate in such that said first polymer liquid is located in a slit created between said first contact optical surface of said plurality of bumps and said second wafer substrate under capillary forces. The method comprises thereafter curing said polymer liquid(s) to form a lens.