Abstract: A heat dissipator is provided including a radiator chimney and a separate heat conducting clamp for use with integrated circuit chips. The radiator chimney functions to conduct heat away from the top surface of the chip, and to radiate the heat upwardly into the air. The heat conducting clamp functions to conduct heat away from the bottom surface of the chip to the radiator chimney and also to securely retain both members of the heat dissipator in contact with the chip. The biasing clamping engagement between the radiator chimney and the heat conducting clamp enables easy mounting of the subject heat dissipator, as well as removal and reuse.