Abstract: A printed circuit board and a method of making the same is disclosed wherein a powdered conductive composition is placed on a dielectric substrate in a matrix corresponding to the desired electrical circuit pattern. The powdered conductive composition is then heated by induction so that the conductive particles are sintered to form continuous conductive pathways secured to the dielectric substrate. The use of relatively high frequency induction currents coupled with a relatively small size of the conductive particles results in rapid heating of the powdered conductive composition while leaving the underlying dielectric substrate unaffected by the induction heating.