Abstract: A method and apparatus for rinsing electroplating solution from the surfaces of articles so that substantially complete recovery of the electroplating solution is achieved. The apparatus is preferably receivable on a wall of an electroplating tank and comprises an open housing-like structure having a splash wall and an open trough beneath the splash wall, and a rack for supporting at least one plated article in front of the splash wall above the trough. For use of the apparatus in accordance with the method, an article is supported on the rack in front of the splash wall, and a rinse solution, such as water, is sprayed onto the article in order to rinse electroplating solution from the surfaces thereof. The rinse solution and any plating solution intermixed therewith gravitate downwardly from the article and the splash wall and are received in the trough and then transferred to the plating tank.