Abstract: A device attachable to a substrate for improving penetration of wireless communication signals is provided. The device is a bendable resin configured to enhance penetration of an incidental radio wave from a first region through the substrate to a second region by forming one or more communication signal beams in the second region. The bendable resin includes a base layer of a first material, and one or more patterned elements each formed by providing a meta-pattern of a second material on the base layer. The first and second materials are different and selected from the group consisting of a dielectric material and a metallic material. Each individual patterned element is configured to tilt the incidental radio wave to form the one or more communication signal beams, wherein each individual communication signal beam is beam-focused at a predetermined focal point or a predetermined focal area in the second region.
Type:
Grant
Filed:
April 14, 2021
Date of Patent:
December 27, 2022
Assignee:
ANTwave Intellectual Property Limited
Inventors:
Kung Bo Ng, Wai Keung Lo, Chun Kit Wong, Chun Hung Lam, Siu Yee Mok, Hang Wong
Abstract: A slotted electrically conductive structure attachable to a substrate and configured to enhance penetration of an incidental radio wave through the substrate is disclosed. The structure allows a substantial portion of the incidental radio wave to penetrate from a first region to a second region through the substrate. The slotted electrically conductive structure comprises a metallic base layer of transparent metal or metal oxide; and one or more patterned slots provided on the metallic base layer. Each of the patterned slots comprises a plurality of feature elements covering an entire area of the patterned slot. The structure reduces thermal energy loss through the substrate and the plurality of feature elements is configured to allow the incidental radio wave to pass through the slotted electrically conductive structure. A multilayer structure comprising the slotted electrically conductive structure and a film structure having randomly distributed irregularly shaped protrusions or pits is also provided.
Type:
Grant
Filed:
January 22, 2020
Date of Patent:
September 27, 2022
Assignee:
ANTwave Intellectual Property Limited
Inventors:
Kung Bo Ng, Chun Kai Leung, Hang Wong, Chi Sun Yu
Abstract: A dielectric material antenna is disclosed. The antenna includes a first material layer made up of a first material with a low dielectric constant. A surface pattern containing pits is carved out of the first material layer. The pits carved out are then filled up with a second material layer made up of a second material that has a high dielectric constant than the first material layer to form a first antenna layer. A wave launcher is provided near to the first antenna layer with a ground provided at its bottom. The wave launcher helps to couple the energy generated from an energy source to the first antenna layer in order to radiate and receive signals.
Type:
Grant
Filed:
October 9, 2018
Date of Patent:
July 23, 2019
Assignee:
Antwave Intellectual Property Limited
Inventors:
Kung Bo Ng, Chun Kai Leung, Ming Lu, Hang Wong, Chi Sun Yu
Abstract: Disclosed are a system, apparatus, and method for improving performance of antennas in electronic devices. The disclosed system, apparatus, and method uses a transparent dielectric substrate as an antenna. The transparent dielectric substrate may receive energy from a wave launcher and printed circuit board. To work as an antenna, the whole structure may include at least one wave launcher located between the dielectric transparent substrate and a printed circuit board. Also, the structure may include a ground at the bottom of solid dielectric transparent substrate with a separation space. The space should not be less than wavelength 1/10 of fundamental resonant frequency.
Type:
Grant
Filed:
December 4, 2017
Date of Patent:
April 2, 2019
Assignee:
Antwave Intellectual Property Limited
Inventors:
Kung Bo Ng, Chun Kai Leung, Ming Lu, Hang Wong, Chi Sun Yu