Patents Assigned to Anwell Precision Technology (HK) Ltd
  • Patent number: 7318867
    Abstract: Techniques for a cover layer with uniform thickness are disclosed. The cover layer is formed with a type of material, such as glue, in hardened form. In one embodiment, a certain amount of the material in liquid form is dispensed onto a dispensing structure. After the dispensing structure is engaged to hold a disc, the dispensing structure and the disc as a whole unit is rotated at a predefined speed. While the dispensed material on the dispensing structure is being dispersed evenly onto the surface of the disc as result of the centrifugal force, a heater is employed to retain or control the temperature of the dispensed material so that the flow of the dispensed material outwards can be effectively controlled to form a cover layer of uniform thickness on the disc.
    Type: Grant
    Filed: August 5, 2005
    Date of Patent: January 15, 2008
    Assignee: Anwell Precision Technology (HK) Ltd
    Inventors: Kai Leung Fan, Ming Sang Yeung