Abstract: The present disclosure describes a composite material that includes a polysulfone aromatic polymer combined with an adhesion promoter, and a reinforcing fiber. The polysulfone aromatic polymer may be a polysulfone aromatic polymer, a polyethersulfone aromatic polymer, or a polyphenylsulfone aromatic polymer. The adhesion promoter may be, for example, a polyamideimide or a polyamide-amic acid polymer. The disclosure also describes a method of making a composite material using a solvent-dissolved polysulfone aromatic polymer and a reinforcing fiber.
Type:
Application
Filed:
March 11, 2014
Publication date:
June 27, 2019
Applicant:
AONIX ADVANCED MATERIALS CORP.
Inventors:
Jerome LE CORVEC, Pierre COAT, David LIEVIN
Abstract: The present disclosure provides a composite material that includes a thermoplastic poly(phenylene) polymer and a re-enforcement component. The poly(phenylene) polymer includes para-phenylene units. At least a portion of the para-phenylene units may be substituted with a polar non-acid functional group. The thermoplastic poly(phenylene) polymer may also include meta-phenylene units. The disclosure also describes a method of making a composite material using a solvent-dissolved poly(phenylene) polymer and a reinforcing fiber.
Type:
Application
Filed:
March 11, 2014
Publication date:
April 28, 2016
Applicant:
AONIX ADVANCED MATERIALS CORP.
Inventors:
Jerome LE CORVEC, Pierre COAT, David LIEVIN