Patents Assigned to AOS Thermal Compounds, LLC
  • Patent number: 6475962
    Abstract: A heat sink material for use in electronic assemblies is disclosed. The heat sink material is a thermal grease that due its composition is dry to the touch and thus eliminates the problems associated with thermal greases in electronic assemblies.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: November 5, 2002
    Assignee: AOS Thermal Compounds, LLC
    Inventor: Prakash Khatri