Patents Assigned to Apack Inc.
  • Patent number: 8277081
    Abstract: Provided is a lamp using LED which has a heat sink and an air-flowing part formed in a body and is equipped with a heat pipe to make higher a heat-conductive efficiency and thereby to make higher a heat-generation performance considerably so that the light emitting diode can be applied to a high-output illumination device to increase a life-time.
    Type: Grant
    Filed: August 25, 2010
    Date of Patent: October 2, 2012
    Assignee: APACK, Inc.
    Inventors: Kyu Seop Song, Kwang Soo Kim, Young Hoon An
  • Publication number: 20120014099
    Abstract: Provided is a lighting system having a printed circuit board on which a plurality of light emitting diodes are arranged; a base holding the printed circuit board; a heat sink provided on a lateral side of the base in a horizontal direction of the printed circuit board; a heat pipe which connects the base with the heat sink; and a rotating unit provided in at least end portion of one end portions and the other end portions of the base or the heat sink, to easily control the illuminating angle and the illuminating range and therefore to improve the energy efficiency, and to improve the heat-radiating property since the heat sink is provided in the lateral side of the substrate of heat-generating member.
    Type: Application
    Filed: August 25, 2010
    Publication date: January 19, 2012
    Applicant: APACK, INC.
    Inventors: Young Hoon An, Kwang Soo Kim, Kyu Sop Song
  • Publication number: 20110235329
    Abstract: Provided is a lamp using LED which has a heat sink and an air-flowing part formed in a body and is equipped with a heat pipe to make higher a heat-conductive efficiency and thereby to make higher a heat-generation performance considerably so that the light emitting diode can be applied to a high-output illumination device to increase a life-time.
    Type: Application
    Filed: August 25, 2010
    Publication date: September 29, 2011
    Applicant: APACK, INC.
    Inventors: Kyu Seop Song, Kwang Soo Kim, Young Hoon An
  • Patent number: D574790
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: August 12, 2008
    Assignee: Apack Inc.
    Inventors: Kyu-Sup Song, Jae-Sup Han, Kwang-Su Kim