Patents Assigned to Apic Yamada Corp.
  • Patent number: 6770236
    Abstract: In the method of resin molding of the present invention, air can be perfectly discharged from a specific area of a molding die including cavities, resin paths, pots, etc. so as to mold high quality products. The method comprises the steps of: covering a specific area of a molding die, in which air is left, with release film; clamping a work piece and the release film between an upper die and a lower die of the molding die so as to air-tightly seal the specific area; discharging the air from the sealed specific area; and filling a molding section with resin.
    Type: Grant
    Filed: August 22, 2001
    Date of Patent: August 3, 2004
    Assignee: APIC Yamada Corp.
    Inventor: Fumio Miyajima
  • Patent number: 6478562
    Abstract: The method of resin molding and a resin molding machine are capable of uniformly control amount of the resin for molding a work piece and pressure of the melted resin. A parting face of one of molding dies, which includes a pot and a cavity, is covered with release film. A work piece to be molded is set in the cavity. Resin is set in the pot. Parts of the release film, which enclose the work piece except a resin path, are clamped by the molding dies. Capacity of the cavity is reduced when the parts of the release film are clamped. The resin is sent from the pot to the cavity so as to mold the work piece in the cavity.
    Type: Grant
    Filed: September 14, 2000
    Date of Patent: November 12, 2002
    Assignee: Apic Yamada Corp.
    Inventor: Fumio Miyajima
  • Patent number: 5891483
    Abstract: The automatic molding machine of the present invention comprises: molding dies; a press mechanism to which the molding dies are attached, the press mechanism clamping and molding a work piece which is set in the molding die; a film feeding mechanism linking with molding action of the press mechanism, the film feeding mechanism feeding release film, which is formed into a long belt form, prescribed length so as to correspond a setting position of the work piece, which is set in the molding die; and a conveying mechanism linking with the molding action of the press mechanism, the conveying mechanism feeding the work piece and resin for molding into the molding die and taking out a molded product therefrom, wherein the work piece is molded by the molding dies whose molding sections are covered with the release film.
    Type: Grant
    Filed: August 21, 1996
    Date of Patent: April 6, 1999
    Assignee: Apic Yamada Corp.
    Inventor: Fumio Miyajima