Abstract: There is provided a surface cleaning apparatus and method using plasma to remove a native oxide layer, a chemical oxide layer, and a damaged portion from a silicon substrate surface, and contaminants from a metal surface. A mixture of H2 and N2 gas is used as a first processing gas. By absorbing potential in a grounded grid or baffle between a plasma generator and a substrate, only radicals are passed to the substrate, and HF gas is used as a second processing gas. Thus a native oxide layer, a chemical oxide layer, or a damaged portion formed on the silicon substrate during etching is removed in annealing step with H2 flow. The environment of a chamber is maintained constant by introducing a conditioning gas after each wafer process. Therefore, process repeatability is improved.

Abstract: There is provided a surface cleaning apparatus and method using plasma to remove a native oxide layer, a chemical oxide layer, and a damaged portion from a silicon substrate surface, and contaminants from a metal surface. By absorbing potential in a grounded grid or baffle between a plasma generator and a substrate, only radicals are passed to the substrate, and HF gas is used as a second processing gas. Thus a native oxide layer, a chemical oxide layer, or a damaged portion formed on the silicon substrate during etching a contact hole is removed and the environment of a chamber is maintained constant by introducing a conditioning gas after each wafer process. Therefore, process uniformity is improved.

Abstract: An apparatus for producing a precisely controlled incision in a bodily surface is provided. The incision device includes a housing and a lancet blade carried by a lancet guide assembly. The lancet guide assembly includes a lancet guide arm mounted within the housing for pivotal movement and a guide surface. The guide surface guides the lancet blade through an arcuate cutting stroke during which the lancet blade extends through an opening in the housing as the lancet guide arm is pivoted between an unfired and a fired position The incision device also includes a trigger mechanism having a trigger arm mounted in the housing for pivotal movement between a ready-to-fire position and firing position. A spring element is arranged within the housing such that it is an unbiased condition when the trigger arm is in the ready-to-fire position and is biased as the trigger arm pivots towards the firing position.