Abstract: A photovoltaic module includes a first photovoltaic cell, a second photovoltaic cell, and a collector-connector which is configured to collect current from the first photovoltaic cell and to electrically connect the first photovoltaic cell with the second photovoltaic cell. The collector-connector may include an electrically insulating carrier and at least one electrical conductor which electrically connects the first photovoltaic cell to the second photovoltaic cell.

Abstract: A sputtering target has a cylindrical backing tube having two edges and a sidewall comprising a middle portion located between two end portions. The sputtering material is on the backing tube. The sputtering material does not cover at least one end portion of the backing tube. The sputtering target also has a feature which prevents or reduces at least one of chalcogen buildup and arcing at the at least one end portion of the backing tube not covered by the sputtering material.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Interface strips and strip/rail spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: Provided are novel interconnecting strips for electrically connecting building integrable photovoltaic (BIPV) modules in a photovoltaic array. An interconnecting strip can be provided between a building structure and the BIPV modules, with electrical connections established by lowering the modules onto the strip previously positioned on the structure. The strip can includes two or more terminal groups aligned with different rows of BIPV modules. Each terminal group includes two or more connector terminals for connecting to the modules in that row. The interconnecting strip also includes leads extending between terminal groups and connecting connector terminals of different groups. In certain embodiments, terminal groups are offset with respect to adjacent groups to align with BIPV modules that are similarly offset to provide a moisture barrier. The interconnecting strip may be reconfigured in the field to provide different electrical connection schemes among BIPV modules.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules having flexible connectors and methods of fabricating thereof. According to various embodiments, a BIP module includes a photovoltaic insert having one or more photovoltaic cells and a flexible connector having a flexible member and a connector member. The flexible member provides flexible mechanical support to the connector member with respect to the insert. The flexible member may include a flat conductive strip, a portion of which is shaped to provide additional flexibility to the flexible member along its width. The connector member encloses one or more conductive elements, such as louvered sockets, which are electrically connected to the photovoltaic insert by the flexible member. In certain embodiments, the same flat conductive strip is used to form a shaped portion as well as conductive element and/or a portion of a bus bar extending into the photovoltaic insert.

Abstract: Apparatus and techniques for mounting frameless photovoltaic modules reduce module stress induced by the mounting configuration. Cable clamps and cable spacing configured to relieve module stress by reducing or eliminating module sag are used.

Abstract: A photovoltaic cell includes a p-type copper-indium-gallium-selenide absorber layer, where a content of Cu, In, and Ga in a first portion of the p-type copper-indium-gallium-selenide absorber layer satisfies the equation Cu/(In+Ga)?0.3, and where the content is measured in atomic percent.

Abstract: A photovoltaic device includes at least one photovoltaic cell and a DC/DC converter electrically coupled to the at least one photovoltaic cell. The at least one photovoltaic cell and the DC/DC converter are integrated into a photovoltaic package.

Abstract: A method and apparatus for forming a sputtering target are provided that includes a copper indium gallium sputtering target material on a backing structure. The sputtering target is formed by compressing pre-alloyed and atomized powders of Cu, In, and Ga at pressures below 35,000 psi. In some embodiments the sputtering target material contains Na, S, or Se. In other embodiments the sputtering target is formed by isothermal compression.

Abstract: An integral mounting and shipping support device. The device includes a mounting structure and a shipping support structure. The shipping support structure is configured to grip an object to be shipped. The device also includes a first stacking structure and a second stacking structure. The first stacking structure of a first mounting and shipping support device is configured to couple with the second stacking structure of a second mounting and shipping support device.

Abstract: Provided herein are high throughput apparatuses for fabricating wire current collector and/or interconnect assemblies for solar cells. In certain embodiments, the wire assemblies include uniformly pitched serpentine wires. According to various embodiments, the apparatuses include a plurality of link heads connected to collapsible links, with the heads spaced apart when the links are in an uncollapsed position and stacked when the links are in a collapsed position. Alternating link heads engage opposite sides of the wire such that, when collapsed, the wire is threaded through engaging members of the heads in a serpentine configuration.

Abstract: Provided are bypass diode assemblies for use in photovoltaic modules. Also provided are methods of fabricating such assemblies and a method of fabricating photovoltaic modules using such assemblies. A diode assembly may include an insulating strip, at least one lead-diode assembly having a diode and two leads, and at least two interconnecting conductors overlapping with and electrically contacting the leads of the lead-diode assembly. The insulating strip supports the lead-diode assembly and conductors and at least partially insulates these components from photovoltaic cells. Specifically, during module fabrication, the interconnecting conductors make electrical connections to the back sides of the cells through cutouts in the insulating strip. The electrical connections may be made to every cell in a row or a subset of selected cells in that row. In certain embodiments, the same interconnecting conductor is connected to two or more cells positioned in adjacent rows.

Abstract: A photovoltaic device is made using a method and a system disclosed herein. The method may comprise: providing a web of photovoltaic material; providing a web of interconnect material; cutting the web of photovoltaic material into a plurality of photovoltaic cells; cutting the web of interconnect material into a plurality of interconnects; providing a respective one of the plurality of interconnects between adjacent photovoltaic cells to electrically connect a first string of photovoltaic cells in series; and laminating the first string of photovoltaic cells which are electrically connected in series between a top laminating sheet and a bottom laminating sheet. The system may comprise: a first conveyor, an optical inspection apparatus, a removal apparatus, a sorter, a second conveyor, and an assembly apparatus configured to place an interconnect between adjacent photovoltaic cells to electrically connect a first string of photovoltaic cells in series.

Abstract: Provided are novel methods of fabricating photovoltaic modules using pressure sensitive adhesives (PSA) to secure wire networks of interconnect assemblies to one or both surfaces of photovoltaic cells. A PSA having suitable characteristics is provided near the interface between the wire network and the cell's surface. It may be provided together as part of the interconnect assembly or as a separate component. The interconnect assembly may also include a liner, which may remain as a part of the module or may be removed later. The PSA may be distributed in a void-free manner by applying some heat and/or pressure. The PSA may then be cured by, for example, exposing it to UV radiation to increase its mechanical stability at high temperatures, in particular at a, for example the maximum, operating temperature of the photovoltaic module. For example, the modulus of the PSA may be substantially increased during this curing operation.

Abstract: Provided are flexible photovoltaic modules having header structures for protecting, reinforcing, and sealing edges formed by sealing sheets of the modules. A flexible module may include one or more header structures. In certain embodiments, two header structures are provided on the same edge or two opposite edges of the module. A header structure may enclose a portion of the edge or the entire edge. A header structure may be a sleeve enclosing an edge formed by two sealing sheets. In other embodiment, in which an edge is formed by only one shorter sealing sheet, a header structure may extend over this edge. A header structure may enclose one or more electrical leads protruding from a sealed space formed by the sealing sheets. These electrical leads may be connected to conductive elements provided within the header structure and used for establishing electrical connections to other components of the photovoltaic array.