Patents Assigned to Apollo Seiko, Ltd.
  • Publication number: 20070057018
    Abstract: There is provided a soldering apparatus that can supply nitrogen gas to each soldering iron, is low in cost, and can increase the workability. A soldering apparatus 100 includes a soldering iron unit 300 having an iron tip heated by a heater unit and a blowout nozzle for blowing out nitrogen gas from near the iron tip; and a control unit 200 connected to the soldering iron unit 300. The control unit 200 incorporates a nitrogen gas supply mechanism for separating nitrogen gas from compressed air by using a hollow yarn bundle serving as a semipermeable membrane for separating nitrogen, which is formed by bundling a plurality of hollow yarns.
    Type: Application
    Filed: June 2, 2006
    Publication date: March 15, 2007
    Applicant: APOLLO SEIKO LTD.
    Inventor: Seiji KAWAGUCHI
  • Patent number: 4899924
    Abstract: The automatic soldering method and related device of this invention can perform both spot soldering and continuous soldering at any soldering position through the application of heat to both the soldering spot and the string solder, using as a heating means, a light beam such as a laser beam. This thus avoids the use of a soldering iron as a heating means and further, the soldering spot is not damaged since heat can be applied to the spot and string solder by a "non-contact" means.
    Type: Grant
    Filed: July 22, 1988
    Date of Patent: February 13, 1990
    Assignee: Apollo Seiko Ltd.
    Inventor: Seiji Kawaguchi
  • Patent number: 4860427
    Abstract: Apparatus for cutting a lead wire (7) from a supply wire (4) and for removing insulation covering portions (5) from the opposite ends of the lead wire (7) includes a pair of pinch rollers (13), a pair of opposed cutters (14), and a gripping device (15). The cutters (14) include wire cutting sections adapted to be moved into butt contact with each other, and insulation covering cutting sections (20) which will only sever the insulation covering without cutting through the entire wire. In order to form the lead wire (7) and remove the insulation covering portions (5) from opposite ends of the lead wire (7), the pinch rollers (13) initially advance the supply wire (4) such that a predetermined portion of the free end of the supply wire (4) extends beyond the cutters (14) as seen in FIG. 5(A).
    Type: Grant
    Filed: April 13, 1988
    Date of Patent: August 29, 1989
    Assignee: Apollo Seiko Ltd.
    Inventor: Seiji Kawaguchi
  • Patent number: 4805830
    Abstract: A method and device for automatic soldering multiple intermittently arranged terminals a bridging phenomenon from occurring between the soldered terminals by sliding, virtually horizontally, the iron tip of the soldering iron, which is held upon the arrayed terminals after the application of the solder to those terminals, in a direction which is at right angles to the direction of the arrayed terminals, thus separating it from the arrayed terminals.
    Type: Grant
    Filed: March 13, 1987
    Date of Patent: February 21, 1989
    Assignee: Apollo Seiko Ltd.
    Inventor: Seiji Kawaguchi
  • Patent number: 4746048
    Abstract: A device which can improve the efficiency of jumper wire wiring work through automatic coiling and soldering of both conductor parts of a jumper wire to selected pins of the multiple pins protruding from a printed circuit board. The device includes a setting finger for gripping the jumper wire and holding the same within the vicinity of the printed circuit board terminal or pin, a wrapping mechanism which includes an eccentrically mounted wrapping pin for engaging the conductor portion of the jumper wire and wrapping or coiling the same about the printed cirucit board terminal or pin, and a soldering mechanism for soldering the jumper wire conductor to the printed circuit board terminal or pin.
    Type: Grant
    Filed: March 13, 1987
    Date of Patent: May 24, 1988
    Assignee: Apollo Seiko Ltd.
    Inventor: Seiji Kawaguchi
  • Patent number: 4738019
    Abstract: A wire stripping apparatus with a mechanism which cuts lead wire to a specified length, and peels off the covering of both ends of the wire before wiring it; through the attachment of a supply finger which conveys the wire to a predetermined position on the printed circuit board or similar for fixing, and positions it there, the device can supply the wire thus obtained to the next process. An automatic wiring device which can automatically perform wire coiling and soldering in a process continuous with the construction of said wiring by combining the work of this wire stripper with an automatic coiling and soldering device.
    Type: Grant
    Filed: March 13, 1987
    Date of Patent: April 19, 1988
    Assignee: Apollo Seiko, Ltd.
    Inventor: Seiji Kawaguchi