Patents Assigned to Applie Materials, Inc.
  • System to identify a wafer manufacturing problem and method therefor
    Publication number: 20040122859
    Abstract: A method (400) for determining a response to a wafer manufacturing process problem includes the steps of generating a wafer map signature (406) containing defect attributes to be identified and retrieving (410) one or more wafer map signatures from a database. The wafer map signature to be identified is matched (414) with the one or more wafer map signatures from the database in order to help find a root cause of a defect in a wafer manufacturing process.
    Type: Application
    Filed: December 20, 2002
    Publication date: June 24, 2004
    Applicant: Applie Materials, Inc.
    Inventors: Yifah Gavra, Amos Dor