Patents Assigned to Applied Electroless Concepts
  • Electroless silver plating composition
    Patent number: 5322553
    Abstract: An electroless silver plating solution comprises a silver(I) complex, a thiosulfate salt, and a sulfite salt. This electroless silver plating solution uses a novel reducing agent combination of thiosulfate and sulfite. It shows a plating rate and a plating solution stability far superior to those of conventional silver plating solutions containing formaldehyde, reducing sugars, borohydride, hydrazine, and other reducing agents.
    Type: Grant
    Filed: February 22, 1993
    Date of Patent: June 21, 1994
    Assignee: Applied Electroless Concepts
    Inventors: Nenad V. Mandich, Gerald A. Krulik, Rajwant Singh