Patents Assigned to Applied Materials, a Delaware corporation
  • Chemical mechanical polishing apparatus with rotating belt
    Publication number: 20040209559
    Abstract: A chemical mechanical polishing apparatus has a rotatable platen, a polishing sheet that is wider than the substrate extending between two reels, a drive mechanism to advance the polishing sheet, and a chucking mechanism to intermittently secure the polishing sheet to the platen. The platen can have a platen base that is adaptable to receive either a circular platen top or a rectangular platen top.
    Type: Application
    Filed: May 3, 2004
    Publication date: October 21, 2004
    Applicant: Applied Materials, a Delaware corporation
    Inventors: Manoocher Birang, Lawrence M. Rosenberg, Sandra L. Rosenberg, Sasson Somekh, John M. White
  • Polishing pad with transparent window having reduced window leakage for a chemical mechanical polishing apparatus
    Publication number: 20030171070
    Abstract: The polishing pad for a chemical mechanical polishing apparatus and method of making the same has a polishing pad with a bottom layer, a polishing surface on a top layer and a transparent sheet of material interposed between the two layers. Slurry from the chemical mechanical polishing process is prevented from penetrating the impermeable transparent sheet to the bottom layer of the polishing pad.
    Type: Application
    Filed: March 18, 2003
    Publication date: September 11, 2003
    Applicant: Applied Materials, a Delaware corporation
    Inventor: Robert D. Tolles
  • Method and apparatus for optical monitoring in chemical mechanical polishing
    Publication number: 20020013120
    Abstract: An apparatus, as well as a method, brings a surface of a substrate into contact with a polishing pad that has a window, causes relative motion between the substrate and the polishing pad, and directs a light beam through the window so that the motion of the polishing pad relative to the substrate causes the light beam to move in a path across the substrate. Light beam reflections from the substrate are detected, and used to determine polishing parameters, detect process repeatability, and qualify processes.
    Type: Application
    Filed: August 14, 2001
    Publication date: January 31, 2002
    Applicant: Applied Materials, a Delaware corporation
    Inventors: Andreas Norbert Wiswesser, Judon Tony Pan, Buguslaw Swedek, Manoocher Birang