Abstract: A system for evaluating manufactured items that includes a memory module; an evaluation unit configured to execute instructions related to the evaluating of the manufactured items while applying a group of features; and a memory leakage unit configured to: select a first feature out of the group of features and disable an execution, by the evaluation unit, of instructions associated with the first feature at a presence of a memory leakage event. The first feature has a priority that is lower than a priority of a second feature of the group of feature. Priorities of features of the group of features are determined based on (i) priority information provided by one or more developers of the instructions related to the evaluating of the manufactured item, and (ii) usage information indicative of usage of the features of the group of features by the evaluation unit.

Abstract: A computerized system and method of training a deep neural network (DNN) is provided. The DNN is trained in a first training cycle using a first training set including first training samples. Each first training sample includes at least one first training image synthetically generated based on design data. Upon receiving a user feedback with respect to the DNN trained using the first training set, a second training cycle is adjusted based on the user feedback by obtaining a second training set including augmented training samples. The DNN is re-trained using the second training set. The augmented training samples are obtained by augmenting at least part of the first training samples using defect-related synthetic data. The trained DNN is usable for examination of a semiconductor specimen.

Abstract: A method for gray level ratio inspection comprising: obtaining an electron image that comprises region of interest (ROI) pixels of a ROI of the sample and reference pixels of a reference region of the sample, where the ROI pixels are obtained by illuminating the ROI with the electron beam and the reference pixels are obtained without illuminating the reference region with an electron beam; calculating a reference dark level value based on values of at least some of the reference pixels; calculating, responsive to the reference dark level value, a gray level ratio between a first gray level value related to a first sub-set of the ROI pixels and a second gray level value related to a second sub-set of the ROI pixels; determining whether the gray level ratio is indicative of a defect; and generating defect information following a determination that the gray level ratio is indicative of the defect.

Abstract: A system for discharging a region of a sample, the system includes (i) illumination optics that is configured to discharge the region by illuminating the region of the sample with a laser pulse during an illumination iteration; and (ii) a timing circuit that is configured to trigger the illumination iteration to occur at a timing that is based on one or more timing constraints associated with a scanning of the region by an electron beam.

Abstract: Disclosed herein is a system for non-destructive tomography of specimens. The system includes a scanning electron microscope (SEM) and a processor(s). The SEM is configured to obtain a sinogram of a tested specimen, parameterized by a vector {right arrow over (s)}, by projecting e-beams on the tested specimen, at each of a plurality of projection directions and offsets, and. for each e-beam, measuring a respective intensity of electrons returned from the tested specimen, The processor(s) is configured to obtain a tomographic map, pertaining to the tested specimen, by determining values indicative of components of a vector {right arrow over (t)} defined by an equation W{right arrow over (t)}={right arrow over (s)}. W is a matrix with components wij specifying a contribution of a j-th voxel in a nominal specimen to an i-th element of a nominal sinogram of the nominal specimen. The matrix W accounts for e-beam expansion and attenuation with depth within the nominal specimen.

Abstract: A positioning system that includes (a) a linear motor that includes a movable magnetic unit and a coil stator, the coil stator includes a group of coil stator segments; wherein the mechanical support unit is mechanically coupled to the movable magnetic unit; (b) a mechanical support element for supporting a sample within a vacuum chamber; (c) a power supply that is configured to independently supply power to different coil stator segments of the coil stator segments to induce a movement of the movable magnetic unit in relation to the coil stator, along a axis; (d) a heat reduction element that is configured to reduce a temperature of the coil stator; and (e) a controller that is configured to control the movement of the movable magnetic unit by controlling the supply of power to the different coil stator segments.

Abstract: An electron beam spot shape reconstruction unit that includes a processing circuit and a memory unit. The processing circuit is configured to reconstruct a shape of an electron beam spot by (i) obtaining multiple groups of images of circular targets of a sample, wherein different groups of images of the multiple groups of images are associated with different polar angles; (ii) processing at least two of the multiple groups of images to determine first-axis edge width information and second-axis edge width information; and (iii) reconstructing the electron beam spot shape based on the first-axis edge width information and second-axis edge width information.

Abstract: Multiple electron beam optics that includes a detection unit that comprises an array of sensors, and a cross talk reduction unit. For each sensor of multiple sensors of the array of sensors: (i) the sensor includes an aperture and a sensing region that is configured to sense relevant backscattered electrons, the relevant backscattered electrons are emitted from the sample as a result of an illumination of the sample with a primary electron beam that is associated with the sensor and passed through the aperture; and (ii) the crosstalk reduction unit is configured to at least partially prevent a detection, by the sensor, of cross talk backscattered electrons, the cross talk backscattered electrons are emitted from the sample as result of an illumination of the sample by one or more primary beams not associated with the sensor.

Abstract: A method of delayering a sample that includes a second layer formed under a first layer, where the first and second layers are different materials or different texture, the method including: acquiring a plurality of gray scale images of the region of interest in an iterative process by alternating a sequence of delayering the region of interest with a first charged particle beam and imaging a surface of the region of interest with a second charged particle beam; after each iteration of acquiring a gray scale image, calculating an entropy of the acquired gray scale image and calculating a second derivative of the entropy; determining whether a transition from the first layer to the second layer occurred based on the second derivative of the entropy; and if it is determined that a transition from the first layer to the second layer did not occur, proceeding with a next iteration of acquiring a plurality of gray scale images, and if it is determined that a transition from the first layer to the second layer did

Abstract: A method and a system for illuminating a substrate, the system may include an acousto-optic device (AOD); and an etendue expanding optical module. The AOD may include a surface having an illuminated region; wherein the illuminated region is configured to receive a collimated input beam while being fed with a control signal that causes the illuminated region to output illuminated region output beams that are collimated and exhibit deflection angles that scan, during a scan period, a deflection angular range. The etendue expanding optical module is configured to convert the illuminated region output beams to collimated output beams that impinge on an output aperture; wherein a collimated output beam has a width that exceeds a width of an illuminated region output beam; and wherein the etendue expanding optical module comprises a Dammann grating that is configured to output diffraction patterns, each diffraction pattern comprises diffraction orders that cover a continuous angular range.

Abstract: There is provided a system to examine a semiconductor specimen, the system comprising a processor and memory circuitry configured to obtain a training sample comprising an image of a semiconductor specimen and a design image based on design data, train a machine learning module, wherein the training includes minimizing a function representative of a difference between a simulated image generated by the machine learning module based on a given design image, and a corrected image corresponding to a given image after correction of pixel position of the given image in accordance with a given displacement matrix, wherein the minimizing includes optimizing parameters of the machine learning module and of the given displacement matrix, wherein the trained machine learning module is usable to generate a simulated image of a specimen based on a design image of the specimen.

Abstract: A method of determining a depth of a hole milled into a first region of a sample, comprising: positioning the sample in a processing chamber having a charged particle beam column; milling a hole in the first region of the sample using a charged particle beam generated by the charged particle beam column; identifying a first registration mark at an upper level of the milled hole; identifying a second registration mark at a lower level of the milled hole; taking a first set of images at a first tilt angle, the first set of images including a first image taken with a field of view that captures the first registration mark but not the second registration mark, and a second image taken with a field of view that captures the second registration mark but not the first registration mark; taking a second set of images at a second tilt angle, different than the first tilt angle, the second set of images including a third image taken with a field of view that captures the first registration mark but not the second regis

Abstract: A sample related system that includes a vacuum chamber, a load lock chamber that includes a first port that is interfaces with a first environment having a first pressure; a second port that interfaces with a second environment that comprises the vacuum chamber; a load lock chamber pressure control unit that is configured to control a pressure within the load lock chamber; and a mass measurement unit that is configured measure a mass of the sample, during at least one point in time, wherein during each point of time of the at least one point in time the load lock chamber is at a load lock chamber vacuum level. The load lock chamber is mechanically isolated from an environment of the sample related system. The vacuumed chamber is for performing a sample related operations elected out of sample evaluation or sample processing.

Abstract: A high voltage noise reduction unit that includes (i) an input that is configured to receive a high voltage input signal (HVIS); (ii) a positive isolated supply unit that is configured to receive the HVIS and to output a positive supply signal that floats on the HVIS; (iii) a negative isolated supply unit that is configured to receive the HVIS and to output a negative supply signal that floats on the HVIS; (iv) a low pass filter that is configured to filter the HVIS to provide a filtered high voltage signal; and (v) an amplifier that is configured to receive the positive supply signal, to receive the negative supply signal, to receive the filtered high voltage signal and amplify the filtered high voltage signal to provide a high voltage output signal.

Abstract: A method for high throughput defect detection, the method may include (i) performing, using first detection channels, a simultaneous inspection process through a segmented pupil plane that comprises multiple pupil plane segments to select one or more pupil plane segments of interest out of multiple pupil plane segments; (ii) configuring one or more configurable filters related to second detection channels to pass radiation received from the one or more pupil plane segment of interest and to block radiation received from one or more non-of-interest pupil plane segments; and (iii) performing, using the second detection channels, a partially masked pupil plane inspection process.

Abstract: A method and a system for illuminating a substrate, the system may include an acousto-optic device (AOD); and an etendue expanding optical module. The AOD may include a surface having an illuminated region; wherein the illuminated region is configured to receive a collimated input beam while being fed with a control signal that causes the illuminated region to output illuminated region output beams that are collimated and exhibit deflection angles that scan, during a scan period, a deflection angular range. The etendue expanding optical module is configured to convert the illuminated region output beams to collimated output beams that impinge on an output aperture; wherein a collimated output beam has a width that exceeds a width of an illuminated region output beam; and wherein the etendue expanding optical module comprises a Dammann grating that is configured to output diffraction patterns, each diffraction pattern comprises diffraction orders that cover a continuous angular range.

Abstract: A chuck that supports a sample in a processing chamber and comprises: a support plate formed from a dielectric material, the support plate including an upper planar support surface sized and shaped to retain a substrate disposed on the support plate; one or more electrodes disposed within the support plate proximate the upper planar support surface; a plurality of lift pin holes formed completely through the support plate; a plurality of stub cavities formed within the support plate, each stub cavity having an opening at the upper planar support surface; a plurality of retractable stubs corresponding in number to the plurality of stub cavities, wherein each retractable stub is disposed in a unique one of the stub cavities; and a stub lift mechanism operable to move each retractable stub in the plurality of stubs between a down position and an up position, wherein in the down position a distal end of the retractable stub is disposed within its respective stub cavity and recessed below the upper planar support

Abstract: An optical metrology model for in-line thickness measurements of a film overlying non-ideal structures on a substrate is generated by performing pre-measurements prior to deposition of the film and performing post-measurements after the deposition. The pre- and post-measurements are performed at at least one of multiple polarization angles or multiple orientations of the substrate. Differences in reflectance between the pre- and post-measurements are determined at the multiple polarization angles and the multiple orientations. At least one of the multiple polarization angles or the multiple orientations are identified where the differences in reflectance are indicative of a suppressed influence from the non-ideal structures. The optical metrology model is generated using the identified polarization angles and the identified orientations as inputs to a machine-learning algorithm.

Abstract: A system that includes a vacuum module that includes a first vacuum source, a first vacuum propagation path, a second vacuum source, and a second vacuum propagation path. The first vacuum source is configured to provide first vacuum of a first vacuum level, via the first vacuum propagation path, to a chuck. The chuck is mounted on a mechanical stage. The second vacuum source is configured to provide second vacuum at a second vacuum level, via the second vacuum propagation path, to the chuck. The second vacuum level exceeds the first vacuum level. The chuck is configured to apply at least one of the first vacuum or the second vacuum to the wafer. The first vacuum propagation path is configured to follow movements of the chuck. The second vacuum propagation path is configured to remain static despite the movements of the chuck.

Abstract: Disclosed herein is a system for non-destructive classification of specimens. The system includes an e-beam source, an X-ray measurement module, and a computational module. The e-beam source is configured to project e-beams on a specimen at one or more e-beam landing energies, so as to penetrate the specimen and induce emission of X-rays. The X-ray measurement module is configured to measure the emitted X-rays. The computational module is configured to process the measurement data to obtain an energy signature of at least one target substance included in the specimen and classify the inspected specimen based on the obtained energy signature and one or more reference energy signatures pertaining to one or more reference specimens, respectively.