Abstract: A method for defect detection includes: (i) scanning at least one wafer by a monitoring system and providing defect size information for each defect that belongs to a group of defects; (ii) scanning the at least one wafer by a wafer inspection system that includes multiple detectors and providing a set of defect detection signals for each defect of the group, wherein the wafer inspection system is characterized by lower resolution than the monitoring system; (iii) classifying the defects to defect classes; (iv) determining multiple relationships between defect types, defect sizes and sets of detection signals; (v) scanning a second wafer by the wafer inspection tool; and (vi) generating, for multiple defects, second wafer defect size information in response to the determined relationships and in response to multiple sets of detection signals generated during the scanning of the second wafer.

Abstract: A printer and method for recording a predefined multiple intensity level image on a substrate, the method includes the steps of: converting the predetermined image to multiple intensity level associated images; converting a light beam to multiple light beam arrays; modulating each light beam array to provide modulated light beam arrays, in response to a corresponding intensity level associated image to be recorded on the substrate; directing each modulated light beam array to impinge on the substrate; and repeating the steps of converting, modulating and directing while moving the substrate until the predefined image is imaged on the substrate.