Patents Assigned to Applied Matreials, Inc.
  • Refurbishing a wafer having a low-k dielectric layer
    Patent number: 7695982
    Abstract: A wafer comprising a low-k dielectric layer is refurbished for reuse. Initially, a removable layer is provided on the wafer. The low-k dielectric layer is formed over the removable layer. The overlying low-k dielectric layer is removed from the wafer by etching away the removable layer by at least partially immersing the wafer in an etching solution. Thereafter, another low-k dielectric layer can be formed over another removable layer.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: April 13, 2010
    Assignee: Applied Matreials, Inc.
    Inventors: Hong Wang, Krishna Vepa, Paul V. Miller