Abstract: A method is provided for synthesizing signal frequencies using low resolution rational division. A reference frequency value and synthesized frequency value are accepted. In response to dividing the synthesized frequency value by the reference frequency value, an integer value numerator (n) and an integer value denominator (d) are determined, with n/d=I(N/D)=I+N/D=(I+1)?(D?N)/D), and where N/D<1. An accumulator creates a sum of (D?N) and a count from a previous cycle, and creates a difference between the sum and the denominator. The sum is compared with the denominator, and a first carry bit is generated. The complement of the first carry bit is added to a first binary sequence, and the first binary sequence is used to generate a k-bit quotient. The k-bit quotient is subtracted from (I+1) to generate a divisor.

Abstract: An Ethernet physical layer (PHY) module is provided with a method for transceiving between a 10GBASE-R client interface and a 100G attachment interface. On each of ten client interface logical lanes a 10GBASE-R signal is accepted. Each 10GBASE-R logical lane is demultiplexed into two 5 gigabit per second (Gbps) pseudo 100GBASE-R logical lanes, creating a total of twenty pseudo 100GBASE-R logical lanes. The pseudo 100GBASE-R logical lanes are arranged into n groups of 20/n pseudo 100GBASE-R logical lanes. Further, the pseudo 100GBASE-R logical lanes from each group are arranged into a 100G attachment logical lane. Finally, a 100G attachment logical lane is transmitted at an attachment interface on each of n physical lanes. In the reverse direction, each of n physical lanes accepts a 100G attachment logical lane at the attachment interface, and a de-aggregation process supplies a 10GBASE-R signal on each of ten client interface logical lanes.

Abstract: System and method for updating a data structure are disclosed. In one embodiment, the method includes providing a data structure that includes a hierarchically arranged set of nodes and branches, and each node has two or less branches, retrieving a first data entry in the data structure via a first node in response to a first data access request, modifying the data structure to generate a first intermediate data structure that keeps the first node and creates a duplicate of the first node, and retrieving a second data entry in the data structure via the duplicate of first node in response to a second data access request. By maintaining at least the first node or a duplicate of the first node during a rebalancing operation of the data structure, the disclosed method supports accessing data entries associated with the first node during the rebalancing operation and therefore improves system performance.

Abstract: A method is provided for demultiplexing optical signals. A first photodiode accepts first optical signals in a first range of wavelengths with second optical signals in a second range of wavelengths greater than the first range. First electrical signals are generated in the first photodiode in response to the first optical signals. A second photodiode accepts the second optical signals, and generates second electrical signals in response to the second optical signals. The first photodiode substantially absorbs photons associated with the first optical signal, and substantially passes photons associated with the second optical signals. In one aspect, the first photodiode has a first coefficient of absorption associated with the first range of wavelengths and the second photodiode has a second coefficient of absorption and a half value layer (HVL) associated with the second range of wavelengths. The first photodiode has thickness less than the HVL of the second photodiode.

Abstract: A method and device are disclosed for providing an ultra low-noise hand gap voltage reference. The method detects a first voltage drop across a first diode reference, and a second voltage drop across a second voltage reference that includes a second diode. The first and second voltage drops are compared. Temperature compensation currents are supplied to the first diode reference and second voltage references in addition to constant currents, where the constant currents have the same value across a first temperature range. As a result of the constant current, a minimal amount of temperature compensation current is required. Alternatively stated, temperature compensation current is provided having a rate of change greater than PTAT. In response to comparing the first voltage drop to the second voltage drop, a true sub-volt hand gap voltage is supplied across a third voltage reference including a diode, that is constant across the first temperature range.

Abstract: A linear source follower amplifier is provided with a first metal-oxide semiconductor (MOS) field effect transistor (FET) having a gate to accept an ac input signal and a source to supply an ac output signal. A second MOS FET has a gate to accept the ac input signal, a source connected to the drain of the first MOS FET. A third MOS FET has a drain connected to the source of the first MOS FET, a gate connected to the drain of the second MOS FET, and a source connected to a first reference voltage. A fourth MOS FET has a drain and a gate connected to the drain of the second MOS FET and a source connected to the first reference voltage. A current source has an input connected to a second reference voltage, and an output connected to the drain of the first MOS FET.

Abstract: A photodetector with a bandwidth-tuned cell structure is provided. The photodetector is fabricated from a semiconductor substrate that is heavily doped with a first dopant. A plurality of adjoining cavities is formed in the semiconductor substrate having shared cell walls. A semiconductor well is formed in each cavity, moderately doped with a second dopant opposite in polarity to the first dopant. A layer of oxide is grown overlying the semiconductor wells and an annealing process is performed. Then, metal pillars are formed that extend into each semiconductor well having a central axis aligned with an optical path. A first electrode is connected to the metal pillar of each cell, and a second electrode connected to the semiconductor substrate. The capacitance between the first and second electrodes decreases in response to forming an increased number of semiconductor wells with a reduced diameter, and forming metal pillars with a reduced diameter.

Abstract: A full-duplex wire-line transceiver is provided with echo cancellation line driver. The transceiver has an impedance matching network with a network interface, and a transmit interface to accept a differential transmit signal for transmission via the network. The impedance matching network has a receive interface to supply a differential receive signal accepted at the network interface, where the transmit interface is coupled to the receive interface. A hybrid circuit has an input to accept the differential receive signal combined with a coupled differential transmit signal, and input to accept a differential echo cancellation (EC) signal. The hybrid circuit has an output to supply the differential receive signal with the coupled differential transmit signal attenuated in response to the differential EC signal. A line driver uses an active current mirror to generate matched transmit and EC signals.

Abstract: A data structure splitting method is provided for processing data using a minimum number of memory accesses. An SoC is provided with a with a central processing unit (CPU), a system memory, an on-chip memory (OCM), and a network interface including an embedded direct memory access (DMA). The network interface accepts a data structure with a header and a payload. The DMA writes the payload in the system memory, and the header in the OCM. The network interface DMA notifies the CPU of the header address in the OCM. The CPU reads the header in the OCM, performs processing instructions, and writes the processed header in the OCM. The CPU sends the address of the processed header in OCM to the network interface DMA. The network interface DMA reads the processed header from the OCM and sends a data structure with the processed header and the payload.

Abstract: An apparatus including top and bottom portions that when mated form a connector. The top portion includes a top connector portion including a first wall, a second wall opposite the first wall, a first top cap connecting the first and second walls, and wherein the first wall comprises a first concave/convex feature for interlocking. The bottom portion includes a bottom connector portion configured to mate with the top connector portion to form the connector. The bottom connector portion includes a third wall, a fourth wall opposite the third wall, a first bottom connecting the third wall and the fourth wall, and wherein the third wall includes a second concave/convex feature for interlocking with the first concave/convex feature, wherein the second concave/convex feature is oriented opposite the first concave/convex feature.

Abstract: A method and system for pre-marking a substrate to provide a visual reference enabling repetitive and accurate component placement on one or more substrates. The method for marking includes determining a first location on a substrate for placing a component relative to a cut outline of the substrate. The method includes placing a fiducial at a second location on the substrate to provide a known dimensional reference to the first location, such that the fiducial and the first location are configured to be in a field-of-view of a component placement machine.

Abstract: Providing for testing of digital sequencing components of an integrated chip is described herein. By way of example, self-test procedures are provided for unidirectional integrated chips that have different sequence generation (e.g., transmission) and sequence monitoring (e.g., receiving) frequencies. A test logic component(s) can be added to an integrated chip to match the sequence generation frequency to the sequence monitoring frequency. This can facilitate self-testing of unidirectional sequence generating components, by modifying a generated sequence at a first datarate to be receivable at a second datarate, and directing the modified sequence to sequence monitoring components of the integrated chip configured to operate at the second datarate.

Abstract: A system and method are provided for adaptively configuring L2 cache memory usage in a system of microprocessors. A system-on-chip (SoC) is provided with a plurality of n selectively enabled processor cores and a plurality of n L2 cache memories. The method associates each L2 cache with a corresponding processor core, and shares the n L2 caches between enabled processor cores. More explicitly, associating each L2 cache with the corresponding processor core means connecting each processor core to its L2 cache using an L2 data/address bus. Sharing the n L2 caches with enabled processors means connecting each processor core to each L2 cache via a data/address bus mesh with dedicated point-to-point connections.

Abstract: Systems and methods are provided that facilitate memory storage in a memory device. The system contains a memory controller and a memory array communicatively coupled to the memory controller. The memory controller sends commands to the memory array and the memory array writes or retrieves data contained therein based upon the command. The memory controller can monitor multiple banks and manage bank activations. Accordingly, memory access overhead can be reduced and memory devices can be more efficient.

Abstract: An optical system including an array of photonic devices that convert light signals to electrical signals or electrical signals to light signals are coupled together and optically coupled to an array of optic fibers of an information channel. A lens couples optical beams generated to at least one array of photonic devices and the array of optic fibers for an optical communication there-between. The array of photonic devices and the array of optic fibers are respectively arranged in a honeycomb configuration.

Abstract: An optical system and method disclosed include a first lens component and a second lens component within the receive path or the transmit path. The first lens component includes at least two aspheric surfaces that oppose one another and generate a collimated beam channel. The second lens component generates a converging beam and magnifies the converging beam with a magnification factor that is different from a magnification factor in the other path, either the receive path or the transmit path. The receive path and the transmit path include symmetrical lengths and asymmetrical magnification factors.

Abstract: Systems and methods are provided that facilitate memory storage in a multi-bank memory device. The system contains a memory controller and a memory array communicatively coupled to the memory controller. The memory controller sends commands to the memory array and the memory array updates or retrieves data contained therein based upon the command. If the memory controller detects a pattern of memory requests, the memory controller can issue a preemptive activation request to the memory array. Accordingly, memory access overhead is reduced.

Abstract: Methods and systems for facilitating alignment of optical systems and optoelectronic systems are disclosed here. The methods and systems include passively detecting images, determining relative positions of components and aligning components. An imaging component can detect images and determine relative positions and repositioning instructions.

Abstract: A method for placing components on a substrate, the method comprising determining a reference point of a mechanical holding jig based upon a plurality of mechanical features of the mechanical holding jig and placing the substrate into the jig such that mechanical features on the substrate align with the mechanical features on the mechanical holding jig. A location of the substrate is determined with the reference point of the mechanical holding jig. The method continues by installing a plurality of first components onto the substrate aligned to the mechanical holding jig. The substrate is removed from the mechanical holding jig and a second component is placed onto the substrate to cover the plurality of first components. The second component is placed onto the substrate to align a plurality of references points of the second component to the mechanical features on the substrate. The second component is secured to the substrate.

Abstract: A photodetector with a bandwidth-tuned cell structure is provided. The photodetector is fabricated from a semiconductor substrate that is heavily doped with a first dopant. A plurality of adjoining cavities is formed in the semiconductor substrate having shared cell walls. A semiconductor well is formed in each cavity, moderately doped with a second dopant opposite in polarity to the first dopant. A layer of oxide is grown overlying the semiconductor wells and an annealing process is performed. Then, metal pillars are formed that extend into each semiconductor well having a central axis aligned with an optical path. A first electrode is connected to the metal pillar of each cell, and a second electrode connected to the semiconductor substrate. The capacitance between the first and second electrodes decreases in response to forming an increased number of semiconductor wells with a reduced diameter, and forming metal pillars with a reduced diameter.