Patents Assigned to Applied Photonics, Inc.
  • Patent number: 6660963
    Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 9, 2003
    Assignee: Applied Photonics, Inc.
    Inventors: Brian Hoekstra, Roger Flannigan, Daniel Wegerif
  • Publication number: 20030024909
    Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
    Type: Application
    Filed: July 16, 2002
    Publication date: February 6, 2003
    Applicant: APPLIED PHOTONICS, INC.
    Inventors: Brian Hoekstra, Roger Flannigan, Daniel Wegerif
  • Patent number: 6489588
    Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
    Type: Grant
    Filed: November 22, 2000
    Date of Patent: December 3, 2002
    Assignee: Applied Photonics, Inc.
    Inventors: Brian Hoekstra, Roger Flannigan, Daniel Wegerif
  • Patent number: 6326600
    Abstract: An optical interconnection for connecting a first integrated circuit to a second integrated circuit includes a plurality of light sources, a plurality of light detectors, a symmetric imaging system, and a plurality of beam steering elements, one for each of the plurality of light sources. Each of the beam steering elements is configured to steer light from its corresponding light source to a new angle which causes the symmetric imaging system to have an effective aperture closer to its plane of symmetry. A mirror may be inserted in the plane of symmetry of the imaging system that folds the system back upon itself, making the object plane and image plane co-incident.
    Type: Grant
    Filed: June 21, 1999
    Date of Patent: December 4, 2001
    Assignee: Applied Photonics, Inc.
    Inventors: Marc P. Christensen, Predrag Milojkovic, Michael W. Haney
  • Patent number: 4905249
    Abstract: A closed loop carbon dioxide laser system includes a catalytic converter in the form of a conduit with an annular recess which is filled with a catalyst of platinum-plated alumina pellets that are externally heated.
    Type: Grant
    Filed: January 6, 1989
    Date of Patent: February 27, 1990
    Assignee: Applied Photonics, Inc.
    Inventor: Robert Turner