Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
Type:
Grant
Filed:
July 16, 2002
Date of Patent:
December 9, 2003
Assignee:
Applied Photonics, Inc.
Inventors:
Brian Hoekstra, Roger Flannigan, Daniel Wegerif
Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
Type:
Application
Filed:
July 16, 2002
Publication date:
February 6, 2003
Applicant:
APPLIED PHOTONICS, INC.
Inventors:
Brian Hoekstra, Roger Flannigan, Daniel Wegerif
Abstract: A method and apparatus for splitting non-metallic substrates includes a laser for generating a laser beam. An integrated cracking devices receives the laser beam and directs the laser beam onto a non-metallic substrate to define the heat affected zone and quench the substrate at a quenching region contained within the heat affected zone. This integrated cracking device includes a housing and optics fitted within the housing for receiving and directing the laser beam onto the substrate. A quenching nozzle is mounted on the housing for quenching the substrate at a quenching region defined within the heat affected zone.
Type:
Grant
Filed:
November 22, 2000
Date of Patent:
December 3, 2002
Assignee:
Applied Photonics, Inc.
Inventors:
Brian Hoekstra, Roger Flannigan, Daniel Wegerif
Abstract: An optical interconnection for connecting a first integrated circuit to a second integrated circuit includes a plurality of light sources, a plurality of light detectors, a symmetric imaging system, and a plurality of beam steering elements, one for each of the plurality of light sources. Each of the beam steering elements is configured to steer light from its corresponding light source to a new angle which causes the symmetric imaging system to have an effective aperture closer to its plane of symmetry. A mirror may be inserted in the plane of symmetry of the imaging system that folds the system back upon itself, making the object plane and image plane co-incident.
Type:
Grant
Filed:
June 21, 1999
Date of Patent:
December 4, 2001
Assignee:
Applied Photonics, Inc.
Inventors:
Marc P. Christensen, Predrag Milojkovic, Michael W. Haney
Abstract: A closed loop carbon dioxide laser system includes a catalytic converter in the form of a conduit with an annular recess which is filled with a catalyst of platinum-plated alumina pellets that are externally heated.