Abstract: Generally, a semiconductor wafer processing system and more specifically, a semiconductor wafer planarization system for polishing a workpiece, such as a semiconductor substrate or wafer. The system generally includes a first polishing module that has a polishing head for retaining a workpiece, a staging module and a set of load cups for transferring the workpiece to and from the polishing head. A primary robot that has a workpiece gripper transfers the workpiece between the first set of load cups and the staging module. The staging module and the load cups comprise transfer locations where processed and unprocessed workpieces may be set within the reach of processing modules and transfer devices so that the dwell time associated with handling polished and unpolished workpieces is reduced. Additionally, a method for transferring wafers about the polishing system is also disclosed.

Abstract: A photoresist plasma pretreatment performed prior to a plasma oxide etch. The plasma pretreatment is performed with an argon plasma or a carbon tetrafluoride and trifluoromethane plasma with lower power than in the main etch or is performed with a plasma of difluoromethane or trifluoromethane and carbon monoxide but no argon diluent gas. Thereby, striations on the oxide wall are reduced.