Abstract: Intermediate resolution-enhancement state layouts are generated based upon an original non-resolution enhanced layout of an integrated circuit and an associated resolution-enhanced layout. The intermediate resolution-enhancement state layout includes fragments corresponding to parts of the original layout and biases associated with the fragments, where the biases indicate distances between the fragments and the resolution-enhanced layout. The fragments are also assigned attributes such as fragment type, fragment location, and biases. The intermediate resolution-enhancement state layouts can be combined to generate the layout for a full chip IC. Two or more intermediate resolution-enhancement state layouts are assembled and are locally reconverged to adjust the resolution enhancement associated with the intermediate resolution-enhancement state layouts and obtain the intermediate resolution-enhancement state layouts for the full IC.
Type:
Grant
Filed:
March 7, 2005
Date of Patent:
July 22, 2008
Assignee:
Aprio Technologies, Inc.
Inventors:
Shao-Po Wu, Xin Wang, Hongbo Tang, Meg Hung
Abstract: Transient edges are used to define shapes in an integrated circuit layout for optical proximity correction. A first variation of the shape includes a first edge, a second edge satisfying an edge transition angle condition in relation to the first edge, and one or more first transition edges connected between the first edge and the second edge. A second variation of the shape includes a third edge, a fourth edge satisfying the same edge transition angle condition in relation to the third edge, and one or more second transition edges connected between the third edge and the fourth edge. Although the first transition edges are different from the second transition edges, both the first and second variations of the shape are identified as having the same shape, thereby allowing flexibility and efficiency in the shape identification process for optical proximity correction.
Abstract: An automated design for manufacturability platform which provides integrated physical verification and manufacturing enhancement operations. The platform uses an efficient data structure capable of handling and manipulating both layout circuit and geometry characteristics, which permits a wide range of operations such as timing analysis, design-rule checking and optical proximity corrections on a single platform. This feature eliminates the need to translate layout representations between various tools without the requirement of using a common database. Moreover, the platform's common user interface enables encapsulated information exchange between the design and the manufacturing teams, permiting early consideration of manufacturing distortion or enhancement impact on circuit performance.
Abstract: An automated design for manufacturability platform for integrated physical verification and manufacturing enhancement operations. Given original layouts and one or more associated resolution-enhanced layouts, intermediate resolution-enhancement state layouts are reconstructed, and selective localized resolution-enhancement reconfigurations, modifications, and/or perturbations are introduced on any existing enhancements in order to improve manufacturability and yield.
Type:
Application
Filed:
April 7, 2004
Publication date:
October 13, 2005
Applicant:
Aprio Technologies, Inc.
Inventors:
Shao-Po Wu, Xin Wang, Hongbo Tang, Meg Hung
Abstract: An automated design for manufacturability platform which provides integrated physical verification and manufacturing enhancement operations. The platform uses an efficient data structure capable of handling and manipulating both layout circuit and geometry characteristics, which permits a wide range of operations such as timing analysis, design-rule checking and optical proximity corrections on a single platform. This feature eliminates the need to translate layout representations between various tools without the requirement of using a common database. Moreover, the platform's common user interface enables encapsulated information exchange between the design and the manufacturing teams, permiting early consideration of manufacturing distortion or enhancement impact on circuit performance.